參數(shù)資料
型號(hào)： intel Pentium II processor
廠商： Intel Corp.
英文描述： Pentium II Processor Mobile Module(帶移動(dòng)模塊奔II處理器)
中文描述： 奔騰II處理器的移動(dòng)模塊（帶移動(dòng)模塊奔二處理器）
文件頁(yè)數(shù)： 41/46頁(yè)
文件大?。?/td> 681K
代理商： INTEL PENTIUM II PROCESSOR
41
INTEL
PENTIUM
II PROCESSOR MOBILE MODULE MMC-1
Figure 15. Pentium
II Processor Mobile Module Thermal Transfer Plate
5.3.
Module Physical Support
Figure 16 shows the standoff support hole patterns, the
board edge clearance, the dimensions of the EMI
containment ring, and the keep-out area. These hole
locations and board edge clearances will remain fixed for all
Intel mobile modules.
5.3.1
Module Mounting Requirements
Three mounting holes secure the module to the electronics.
See Figure 11 for mounting hole locations. Intel
recommends that all three mounting holes be used to ensure
long term reliability of the system. The hole patterns also
have a plated surrounding ring, which can be uses with a
metal standoff for EMI shielding purposes.
The board edge clearance includes a 0.762 mm (0.030 in)
width EMI containment ring around the perimeter of the
module. This ring is on each layer of the module PCB and is
grounded. The metal on the surface of the module is
exposed for EMI shielding purposes.
Standoffs should be used to provide support for the installed
Pentium II processor mobile module. The distance from the
bottom of the module PCB to the top of the OEM system
electronics board with the connectors mated is 4.0 mm +0.16
mm / -0.13 mm. However warpage of the baseboard may
vary and should be calculated into the final. All calculations
can be made with the Intel MMC-1 Standoff/Receptacle
Height Spreadsheet Information on this spreadsheet can be
obtained from your local Intel representative.
5.3.2.
Module Weight
The weight of the Pentium
II processor mobile module is 48g +/- 2g.
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