參數(shù)資料
型號(hào): IS75V16F128GS32-7065BI
廠商: INTEGRATED SILICON SOLUTION INC
元件分類: 存儲(chǔ)器
英文描述: 3.0 Volt Multi-Chip Package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA107
封裝: 9 X 10 MM, 0.80 MM PITCH, FBGA-107
文件頁(yè)數(shù): 51/52頁(yè)
文件大?。?/td> 264K
代理商: IS75V16F128GS32-7065BI
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY INFORMATION
Rev. 00D
03/24/03
51
IS75V16F128GS32
ISSI
10 9 8 7 6 5 4 3 2 1
1 2 3 4 5 6 7 8 9 10
A
B
C
D
E
F
G
H
J
K
L
M
A
B
C
D
E
F
G
H
J
K
L
M
0.40 +
0.10/0.05
(107X)
D
e
e
A1
SEATING PLANE
A
D1
E1
E
Symbol
Min.
Typ.
Max.
Units
A
1.15
1.25
1.40
mm
A1
0.05
0.10
0.15
mm
D
9.90
10.00
10.10
mm
D1
8.80
mm
E
8.90
9.00
9.10
mm
E1
7.20
mm
e
0.80
mm
MINI BALL GRID ARRAY –
107-Ball BGA
PACKAGE CODE: B
(
9.00 mm x 10.00 mm Body, 0.8 mm Ball Pitch
)
相關(guān)PDF資料
PDF描述
IS75V16F64GS16-7080DI 64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP)
IS80C31 CMOS SINGLE CHIP 8-BIT MICROCONTROLLER
IS80C31-12PL CMOS SINGLE CHIP 8-BIT MICROCONTROLLER
IS80C31-12PLI CMOS SINGLE CHIP 8-BIT MICROCONTROLLER
IS80C31-12PQ CMOS SINGLE CHIP 8-BIT MICROCONTROLLER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IS75V16F64GS16-7080DI 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:64 Mbit FLASH MEMORY AND 16 Mbit PSEUDO SRAM STACKED MULTI-CHIP PACKAGE (MCP)
IS76 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO
IS76K 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO
IS76KS 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO
IS76L 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO