參數(shù)資料
型號(hào): KSZ8692XPB
廠商: Micrel Inc
文件頁數(shù): 16/42頁
文件大小: 0K
描述: IC ARM9 PHY 10/100MBPS 400-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: KSZx692
應(yīng)用: 網(wǎng)絡(luò)和通信
核心處理器: ARM9
程序存儲(chǔ)器類型: 外部程序存儲(chǔ)器
控制器系列: KSZ
接口: EBI/EMI,以太網(wǎng),I²C,I²S,PCI,SPI,UART/USART,USB
輸入/輸出數(shù): 20
電源電壓: 1.235 V ~ 1.365 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 400-BGA
包裝: 托盤
供應(yīng)商設(shè)備封裝: 400-PBGA(24x24)
產(chǎn)品目錄頁面: 1080 (CN2011-ZH PDF)
其它名稱: 576-3537
Micrel, Inc.
KSZ8692MPB/KSZ8692XPB
March 2010
23
M9999-031810-4.0
Signal Descriptions by Group
Pin Number
Pin Name
Pin Type
Pin Description
System Interface
R5
RESETN
I
Reset, asserted Low.
RESETN will force the KSZ8692MPB/KSZ8692XPB to reset ARM9 CPU and
all functional blocks. Once asserted, RESETN must remain asserted for a
minimum duration of 256 system clock cycles. When in the reset state, all the
output pins are put into Tri-state and all open drain signals are floated.
N5
WRSTO
O
Watchdog Timer Reset Output
When the Watchdog Timer expires, this signal will be asserted for at least 200
msec.
W1
XCLK2
I
System Clock Input 2.
External crystal or clock input 2. The clock frequency should be 25MHz
±
100ppm.
Y1
XCLK1
I
System Clock Input 1.
Used with XCLK1 pin when other polarity of crystal is needed. This is unused
for a normal clock input.
H19
CLK25MHz
O
25MHz output to external PHY
Y15, Y14
DDCLKO[1:0]
O
DDR Clock Out [1:0].
Output of the internal system clock, it is also used as the clock signal for DDR
interface.
W15, W14
DDCLKON[1:0]
O
The negative of differential pair of DDR Clock Out [1:0].
Output of the internal system clock, it is also used as the clock signal for DDR
interface.
U13
SDCLKEO
O
Clock Enable output for SDRAM (for Power Down Mode)
T7, U7
VREF
I
Reference Voltage for SSTL interface.
Must be half of the voltage for the DDR VDD supply. See EIA/JEDEC standard
EIA/JESD8-9 (Stub series terminated logic for 2.5V, SSTL_2)
W3
SDOCLK
O
DDR Clock Out for loopback from De-skew PLL
Y3
SDICLK
I
DDR Clock In from loopback to De-skew PLL. This pin must connect to
SDOCLK with appropriate de-skew length. See Engineering Evaluation Design
Kit for detailed implementation.
Y17, Y16
DDCLKO[3:2]
O
Factory Reserved
W17, W16
DDCLKON[3:2]
O
Factory Reserved
NAND/SRAM/ROM/EXIO Interface
L2, K1, K2,
J3, H5, H4,
J2, H3, J1,
H2, G5, H1,
G3, G4, G2,
F1, G1, F2,
F3, F5, F4,
E1, E2, E3
SADDR[23..0]
O
SRAM Address Bus.
The 24-bit address bus covers 16M word memory space of
ROM/SRAM/FLASH, and 16M byte external I/O banks.
This address bus is shared between ROM/SRAM/FLASH/EXTIO devices.
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