(V
參數(shù)資料
型號: KSZ8692XPB
廠商: Micrel Inc
文件頁數(shù): 31/42頁
文件大小: 0K
描述: IC ARM9 PHY 10/100MBPS 400-PBGA
標準包裝: 40
系列: KSZx692
應(yīng)用: 網(wǎng)絡(luò)和通信
核心處理器: ARM9
程序存儲器類型: 外部程序存儲器
控制器系列: KSZ
接口: EBI/EMI,以太網(wǎng),I²C,I²S,PCI,SPI,UART/USART,USB
輸入/輸出數(shù): 20
電源電壓: 1.235 V ~ 1.365 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 400-BGA
包裝: 托盤
供應(yīng)商設(shè)備封裝: 400-PBGA(24x24)
產(chǎn)品目錄頁面: 1080 (CN2011-ZH PDF)
其它名稱: 576-3537
Micrel, Inc.
KSZ8692MPB/KSZ8692XPB
March 2010
37
M9999-031810-4.0
Absolute Maximum Ratings
(1)
Supply Voltage
(VDD1.2, PLLDVDD1.2, PLLSVDD1.2,
USB1VDD1.2, USB2VDD1.2 ) ..................–0.5V to +1.6V
VDD2.5…… ......……… …………………..–0.5V to +3.0V
(VDD3.3, PLLVDDA3.3, PLLDVDD3.3,
USB1VDDA3.3, USB2VDDA3.3,
USBCVDDA3.3).......................................–0.5V to +4.0V
Input Voltage (all inputs) ...........................–0.5V to +4.0V
Output Voltage (all outputs) ......................–0.5V to +4.0V
Pb-Free Temperature (soldering, 10sec.)...............260°C
Storage Temperature (Ts) ..................... –55°C to +150°C
Operating Ratings
(2)
Supply Voltage
(VDD1.2, PLLDVDD1.2, PLLSVDD1.2,
USB1VDD1.2, USB2VDD1.2 ) ........ +1.235V to +1.365V
VDD2.5
............................................. +2.3V to +2.7V
(VDD3.3, PLLVDDA3.3, PLLDVDD3.3,
USB1VDDA3.3, USB2VDDA3.3,
USBCVDDA3.3)..................................... +3.0V to +3.6V
Ambient Temperature (TA)
Commercial.............................................0°C to +70°C
Industrial .............................................-40°C to +85°C
Junction Temperature (TJ) ..................................... 150°C
Package Thermal Resistance
(3)
(
θJA) No Air Flow ...................................23.4°C/W
1m/s ..............................................21.1°C/W
2m/s ..............................................20.2°C/W
(
ψJC) No Air Flow .....................................9.5°C/W
Electrical Characteristics
(4)
Symbol
Parameter
Condition
Min
Typ
Max
Units
Total Supply Current with WAN and LAN ports 100% Utilization, DDR clock = 200MHz
I1.3V
VDD1.2, PLLDVDD1.2,
PLLSVDD1.2, USB1VDD1.2,
USB2VDD1.2
Single supply at 1.3V
540
mA
I2.6V
VDD2.5
Single supply at 2.6V
135
mA
I3.3v
VDD3.3, PLLVDDA3.3,
PLLDVDD3.3, USB1VDDA3.3,
USB2VDDA3.3, USBCVDDA3.3
Single supply at 3.3V
105
mA
TTL Inputs ( SDIO, Static Memory, UART, SPI, I2C, I2S, MDC/MDIO, GPIO)
VIH
Input High Voltage
2.0
V
VIL
Input Low Voltage
0.8
V
IIN
Input Current
(Excluding pull-up/pull-down)
VIN = GND ~ VDD3.3
–10
10
A
TTL Outputs (SDIO, Static Memory, UART, SPI, I2C, I2S, MDC/MDIO, GPIO)
VOH
Output High Voltage
IOH = –8mA
2.4
V
VOL
Output Low Voltage
IOL = 8mA
0.4
V
IOZ
Output Tri-state Leakage
10
A
PCI Electrical: Compliant to PCI version 2.3 Standard
DDR Electrical: Compliant to EIA/JEDEC standard EIA/JESD8-9 (Stub series terminated logic for 2.5V, SSTL_2)
USB 2.0 Electrical: Compliant to USB 2.0 Standard
MII Electrical: compliant to IEEE 802.3u Specification
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating. Unused inputs must always be tied to an appropriate logic voltage level (Ground
to VDD).
3. No heat spreader in package.
4. TA = 25°C. The specification is for the packaged product only.
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