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| 型號： | MC8610TVT1066JB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 83/96頁 |
| 文件大?。?/td> | 0K |
| 描述： | MPU E600 CORE 1066MHZ 783-PBGA |
| 標(biāo)準(zhǔn)包裝： | 36 |
| 系列： | MPC86xx |
| 處理器類型： | 32-位 MPC86xx PowerPC |
| 速度： | 1.066GHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 783-BBGA，F(xiàn)CBGA |
| 供應(yīng)商設(shè)備封裝： | 783-FCPBGA（29x29） |
| 包裝： | 托盤 |
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MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Hardware Design Considerations
Freescale Semiconductor
84
3.11
Guidelines for PCI Interface Termination
PCI termination if PCI is not used at all.
Option 1
If PCI arbiter is enabled during POR,
— All AD pins will be driven to the stable states after POR. Therefore, all ADs pins can be floating. This includes
PCI_AD[31:0], PCI_C/BE[3:0], and PCI_PAR signals.
— All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor.
— It is optional to disable PCI block through DEVDISR register after POR reset.
Option 2
If PCI arbiter is disabled during POR,
— All AD pins will be in the input state. Therefore, all ADs pins need to be grouped together and tied to OVDD
through a single (or multiple) 10-k
Ω resistor(s)
— All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor
— It is optional to disable PCI block through DEVDISR register after POR reset.
3.12
Thermal
This section describes the thermal specifications of the MPC8610.
3.12.1
Thermal Characteristics
Table 62 provides the package thermal characteristics for the MPC8610.
3.12.2
Thermal Management Information
This section provides thermal management information for the flip-chip, plastic ball-grid array (FC_PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material. The MPC8610 implements several features designed to assist with thermal management,
including the temperature diode. The temperature diode allows an external device to monitor the die temperature in order to
detect excessive temperature conditions and alert the system; see Section 3.12.2.5, “Temperature Diode,” for more information.
Table 62. Package Thermal Characteristics1
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
RθJA
24
°C/W
1
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
RθJA
18
°C/W
1
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
RθJMA
18
°C/W
1
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
15
°C/W
1
Junction-to-board thermal resistance
RθJB
10
°C/W
2
Junction-to-case thermal resistance
RθJC
<0.1
°C/W
3
Notes:
1. Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
2. Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for
the specified package.
3. Junction-to-case resistance is less than 0.1°C/W because the silicon die is the top of the packaging case..
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MC8610TVT1066JZ | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications |
| MC8610TVT1067G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610TVT1067J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610TVT1333JB | 制造商:Freescale Semiconductor 功能描述:MPC8XXX RISC 32-BIT 0.09UM 1.333GHZ 1.8V/2.5V/3.3V 783-PIN B - Bulk |
| MC8610TVT667FB | 功能描述:微處理器 - MPU REV 1.1 8610 1.0V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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