參數(shù)資料
型號(hào)： MC8610TVT1066JB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 88/96頁(yè)
文件大小： 0K
描述： MPU E600 CORE 1066MHZ 783-PBGA
標(biāo)準(zhǔn)包裝： 36
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.066GHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
Hardware Design Considerations
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
89
modeled as a collapsed thermal resistance with thermal conductivity of 12.1 W/(m K) and an effective height of 0.1 mm. The
thermal model uses median dimensions to reduce grid. Please refer to the case outline for actual dimensions.
The thermal model uses approximate dimensions to reduce grid. The approximations used do not impact thermal performance.
Please refer to the case outline for exact dimensions.
Figure 57. MPC8610 Thermal Model
3.12.2.5
Temperature Diode
The MPC8610 has a temperature diode on the microprocessor that can be used in conjunction with other system temperature
monitoring devices (such as Analog Devices, ADT7461). These devices use the negative temperature coefficient of a diode
operated at a constant current to determine the temperature of the microprocessor and its environment. For proper operation,
the monitoring device used should auto-calibrate the device by canceling out the VBE variation of each MPC8610’s internal
diode.
The following are the specifications of the MPC8610 on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA @ 125
°C
Bump and Underfill
Die
Substrate
Solder/Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Die (8.5 x 9.7 x 0.86mm)
Silicon
Temperature
dependent
Bump and Underfill (8.5
× 9.7 × 0.07 mm)
Collapsed Resistance
kz
8.1
W/(m K)
Substrate (29
× 29 × 1.18 mm)
kx
23.3
W/(m K)
ky
23.3
kz
0.95
Solder and Air (29
× 29 × 0.4 mm)
kx
0.034
W/(m K)
ky
0.034
kz
12.1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC8610TVT1066JZ 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications
MC8610TVT1067G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8610TVT1067J 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8610TVT1333JB 制造商:Freescale Semiconductor 功能描述:MPC8XXX RISC 32-BIT 0.09UM 1.333GHZ 1.8V/2.5V/3.3V 783-PIN B - Bulk
MC8610TVT667FB 功能描述:微處理器 - MPU REV 1.1 8610 1.0V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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