參數(shù)資料
型號(hào): MPC755BVT300LE
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 3/56頁(yè)
文件大?。?/td> 0K
描述: MCU HIP4DP 300MHZ 360-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC7xx
處理器類型: 32-位 MPC7xx PowerPC
速度: 300MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 7 provides the power consumption for the MPC755.
Capacitance, Vin = 0 V, f = 1 MHz
Cin
5.0
pF
3, 4
Notes:
1. Nominal voltages; see Table 3 for recommended operating conditions.
2. For processor bus signals, the reference is OVDD while L2OVDD is the reference for the L2 bus signals.
3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals.
4. Capacitance is periodically sampled rather than 100% tested.
5. The leakage is measured for nominal OVDD and VDD, or both OVDD and VDD must vary in the same direction (for example,
both OVDD and VDD vary by either +5% or –5%).
Table 7. Power Consumption for MPC755
Processor (CPU) Frequency
Unit
Notes
300 MHz
350 MHz
400 MHz
Full-Power Mode
Typical
3.1
3.6
5.4
W
1, 3, 4
Maximum
4.5
6.0
8.0
W
1, 2
Doze Mode
Maximum
1.8
2.0
2.3
W
1, 2, 4
Nap Mode
Maximum
1.0
W
1, 2, 4
Sleep Mode
Maximum
550
mW
1, 2, 4
Sleep Mode (PLL and DLL Disabled)
Maximum
510
mW
1, 2
Notes:
1. These values apply for all valid processor bus and L2 bus ratios. The values do not include I/O supply power (OVDD and
L2OVDD) or PLL/DLL supply power (AVDD and L2AVDD). OVDD and L2OVDD power is system dependent, but is typically
<10% of VDD power. Worst case power consumption for AVDD = 15 mW and L2AVDD = 15 mW.
2. Maximum power is measured at nominal VDD (see Table 3) while running an entirely cache-resident, contrived sequence of
instructions which keep the execution units maximally busy.
3. Typical power is an average value measured at the nominal recommended VDD (see Table 3) and 65°C in a system while
running a typical code sequence.
4. Not 100% tested. Characterized and periodically sampled.
Table 6. DC Electrical Specifications (continued)
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
相關(guān)PDF資料
PDF描述
IDT7016S35J8 IC SRAM 144KBIT 35NS 68PLCC
ASC65DRAI-S734 CONN EDGECARD 130PS .100 R/A PCB
MPC8535BVTAKGA MPU POWERQUICC III 783FCPBGA
ACB95DHBT CONN EDGECARD 190PS R/A .050 DIP
FMM43DSEI-S243 CONN EDGECARD 86POS .156 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
MPC755CPX400LER2 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324