參數(shù)資料
型號: MPC755BVT300LE
廠商: Freescale Semiconductor
文件頁數(shù): 35/56頁
文件大?。?/td> 0K
描述: MCU HIP4DP 300MHZ 360-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC7xx
處理器類型: 32-位 MPC7xx PowerPC
速度: 300MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
40
Freescale Semiconductor
System Design Information
Figure 22 describes the driver impedance measurement circuit described above.
Figure 22. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC755. A voltage
source, Vforce, is connected to the output of the MPC755 as shown in Figure 23. Data is held low, the
voltage source is set to a value that is equal to (L2)OVDD/2 and the current sourced by Vforce is measured.
The voltage drop across the pull-down device, which is equal to (L2)OVDD/2, is divided by the measured
current to determine the output impedance of the pull-down device, RN. Similarly, the impedance of the
pull-up device is determined by dividing the voltage drop of the pull-up, (L2)OVDD/2, by the current sank
by the pull-up when the data is high and Vforce is equal to (L2)OVDD/2. This method can be employed with
either empirical data from a test setup or with data from simulation models, such as IBIS.
RP and RN are designed to be close to each other in value. Then Z0 = (RP + RN)/2.
Figure 23 describes the alternate driver impedance measurement circuit.
Figure 23. Alternate Driver Impedance Measurement Circuit
(L2)OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
(L2)OVDD
BGA
Data
Pin
Vforce
OGND
相關(guān)PDF資料
PDF描述
IDT7016S35J8 IC SRAM 144KBIT 35NS 68PLCC
ASC65DRAI-S734 CONN EDGECARD 130PS .100 R/A PCB
MPC8535BVTAKGA MPU POWERQUICC III 783FCPBGA
ACB95DHBT CONN EDGECARD 190PS R/A .050 DIP
FMM43DSEI-S243 CONN EDGECARD 86POS .156 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
MPC755CPX400LER2 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324