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| 型號： | MPC755BVT300LE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 7/56頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU HIP4DP 300MHZ 360-PBGA |
| 標(biāo)準(zhǔn)包裝： | 44 |
| 系列： | MPC7xx |
| 處理器類型： | 32-位 MPC7xx PowerPC |
| 速度： | 300MHz |
| 電壓： | 2V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-BBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
15
Electrical and Thermal Characteristics
Table 10. Processor Bus AC Timing Specifications 1
At recommended operating conditions (see Table 3)
Parameter
Symbol
All Speed Grades
Unit
Notes
Min
Max
Setup times: All inputs
tIVKH
2.5
—
ns
Input hold times: TLBISYNC, MCP, SMI
tIXKH
0.6
—
ns
6
Input hold times: All inputs, except TLBISYNC, MCP, SMI
tIXKH
0.2
—
ns
6
Valid times: All outputs
tKHOV
—4.1
ns
Output hold times: All outputs
tKHOX
1.0
—
ns
SYSCLK to output enable
tKHOE
0.5
—
ns
2
SYSCLK to output high impedance (all except ABB, ARTRY, DBB)tKHOZ
—6.0
ns
2
SYSCLK to ABB, DBB high impedance after precharge
tKHABPZ
—1.0
tsysclk
2, 3, 4
Maximum delay to ARTRY precharge
tKHARP
—1
tsysclk
2, 3, 5
SYSCLK to ARTRY high impedance after precharge
tKHARPZ
—2
tsysclk
2, 3, 5
Notes:
1. Revisions prior to Rev. 2.8 (Rev. E) were limited in performance and did not conform to this specification. For more
information, refer to Section 10.2, “Part Numbers Not Fully Addressed by This Document.”
2. Guaranteed by design and characterization.
3. tsysclk is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by the period of
SYSCLK to compute the actual time duration (in ns) of the parameter in question.
4. Per the 60x bus protocol, TS, ABB, and DBB are driven only by the currently active bus master. They are asserted low, then
precharged high before returning to high-Z as shown in Figure 6. The nominal precharge width for TS, ABB, or DBB is
0.5
× t
sysclk, that is, less than the minimum tsysclk period, to ensure that another master asserting TS, ABB, or DBB on the
following clock will not contend with the precharge. Output valid and output hold timing is tested for the signal asserted.
Output valid time is tested for precharge. The high-Z behavior is guaranteed by design.
5. Per the 60x bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following AACK.
Bus contention is not an issue since any master asserting ARTRY will be driving it low. Any master asserting it low in the first
clock following AACK will then go to high-Z for one clock before precharging it high during the second cycle after the assertion
of AACK. The nominal precharge width for ARTRY is 1.0 tsysclk; that is, it should be high-Z as shown in Figure 6 before the
first opportunity for another master to assert ARTRY. Output valid and output hold timing is tested for the signal asserted.
Output valid time is tested for precharge. The high-Z and precharge behavior is guaranteed by design.
6. MCP and SRESET must be held asserted for a minimum of two bus clock cycles; INT and SMI should be held asserted until
the exception is taken; CKSTP_IN must be held asserted until the system has been reset. See the MPC750 RISC
Microprocessor Family User’s Manual for more information.
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