參數資料
型號： MPC755BVT300LE
廠商： Freescale Semiconductor
文件頁數： 49/56頁
文件大小： 0K
描述： MCU HIP4DP 300MHZ 360-PBGA
標準包裝： 44
系列： MPC7xx
處理器類型： 32-位 MPC7xx PowerPC
速度： 300MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 360-BBGA，FCCBGA
供應商設備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
53
Ordering Information
10 Ordering Information
Ordering information for the devices fully covered by this specification document is provided in
correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office. In addition to the processor frequency, the part numbering scheme also includes an
application modifier which may specify special application conditions. Each part number also contains a
revision code which refers to the die mask revision number. Section 10.2, “Part Numbers Not Fully
Addressed by This Document,” lists the part numbers which do not fully conform to the specifications of
this document. These special part numbers require an additional document called a hardware specifications
addendum.
10.1
Part Numbers Fully Addressed by This Document
Table 20 provides the Freescale part numbering nomenclature for the MPC755 and MPC745 devices fully
addressed by this document.
Table 20. Part Numbering Nomenclature
MPC
xxx
x
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency
Application Modifier
Revision Level
XPC2
755
745
B = HiP4DP
PX = PBGA
RX = CBGA
300
350
L: 2.0 V ± 100 mV
0
° to 105°C
E: 2.8; PVR = 0008 3203
755
C = HiP4DP
400
MPC
755
B = HiP4DP
300
350
C = HiP4DP
350
400
745
B = HiP4DP
PX = PBGA
300
350
745
C = HiP4DP
PX = PBGA
VT = PBGAPb-
free BGA
350
755
745
B = HiP4DP
VT = PBGAPb-
free BGA
300
350
755
C = HiP4DP
350
400
Notes:
1. See Section 7, “Package Description,” for more information on available package types.
2. The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13.
These are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified
technology to simulate normal production. These parts have only preliminary reliability and characterization data. Before
pilot production prototypes may be shipped, written authorization from the customer must be on file in the applicable
sales office acknowledging the qualification status and the fact that product changes may still occur while shipping pilot
production prototypes
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相關代理商/技術參數
參數描述
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
MPC755CPX400LER2 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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