參數(shù)資料
型號(hào): MPC755CVT400LE
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 18/56頁(yè)
文件大?。?/td> 0K
描述: MCU HIP4DP 400MHZ 360-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC7xx
處理器類型: 32-位 MPC7xx PowerPC
速度: 400MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤(pán)
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
25
Pin Assignments
5
Pin Assignments
Figure 16 (in Part A) shows the pinout of the MPC745, 255 PBGA package as viewed from the top surface.
Part B shows the side profile of the PBGA package to indicate the direction of the top surface view.
Part A
Figure 16. Pinout of the MPC745, 255 PBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
78
910 11 12 13 14 15 16
Not to Scale
View
Part B
Die
Substrate Assembly
Encapsulant
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