MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
29
Pinout Listings
Table 15 provides the pinout listing for the MPC755, 360 PBGA and CBGA packages.
VOLTDET
F3
High
Output
—
6
Notes:
1. OVDD supplies power to the processor bus, JTAG, and all control signals; and VDD supplies power to the processor core and
the PLL (after filtering to become AVDD). These columns serve as a reference for the nominal voltage supported on a given
signal as selected by the BVSEL pin configuration of Table 2 and the voltage supplied. For actual recommended value of Vin 2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
3. This pin must be pulled up to OVDD for proper operation of the processor interface. To allow for future I/O voltage changes,
provide the option to connect BVSEL independently to either OVDD or GND.
4. Uses 1 of 15 existing no connects in the MPC740, 255 BGA package.
5. Internal pull-up on die.
6. Internally tied to GND in the MPC745, 255 BGA package to indicate to the power supply that a low-voltage processor is
present. This signal is not a power supply input.
Caution: This differs from the MPC755, 360 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes
A[0:31]
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3,
G6, H2, E2, L3, G5, L4, G4, J4, H7, E1, G2, F3, J7, M3,
H3, J2, J6, K3, K2, L2
High
I/O
OVDD
AACK
N3
Low
Input
OVDD
ABB
L7
Low
I/O
OVDD
AP[0:3]
C4, C5, C6, C7
High
I/O
OVDD
ARTRY
L6
Low
I/O
OVDD
AVDD
A8
—
2.0 V
BG
H1
Low
Input
OVDD
BR
E7
Low
Output
OVDD
BVSEL
W1
High
Input
OVDD
3, 5, 6
CI
C2
Low
Output
OVDD
CKSTP_IN
B8
Low
Input
OVDD
CKSTP_OUT
D7
Low
Output
OVDD
CLK_OUT
E3
—
Output
OVDD
DBB
K5
Low
I/O
OVDD
DBDIS
G1
Low
Input
OVDD
DBG
K1
Low
Input
OVDD
DBWO
D1
Low
Input
OVDD
Table 14. Pinout Listing for the MPC745, 255 PBGA Package (continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes