參數(shù)資料
型號： MPC755CVT400LE
廠商： Freescale Semiconductor
文件頁數(shù)： 55/56頁
文件大?。?/td> 0K
描述： MCU HIP4DP 400MHZ 360-PBGA
標準包裝： 44
系列： MPC7xx
處理器類型： 32-位 MPC7xx PowerPC
速度： 400MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 360-BBGA，F(xiàn)CCBGA
供應商設備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
8
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC755.
Table 4 provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was
initially sampled in a CBGA package, but production units are currently provided in both a CBGA and a
PBGA package. Because of the better long-term device-to-board interconnect reliability of the PBGA
package, Freescale recommends use of a PBGA package except where circumstances dictate use of a
CBGA package. The MPC745 is offered in a PBGA package only.
Table 3. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended Value
Unit
Notes
300 MHz, 350 MHz
400 MHz
Min
Max
Min
Max
Core supply voltage
VDD
1.80
2.10
1.90
2.10
V
3
PLL supply voltage
AVDD
1.80
2.10
1.90
2.10
V
3
L2 DLL supply voltage
L2AVDD
1.80
2.10
1.90
2.10
V
3
Processor bus supply
voltage
BVSEL = 1
OVDD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
L2 bus supply voltage
L2VSEL = 1
L2OVDD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
Input voltage
Processor bus
Vin
GND
OVDD
GND
OVDD
V
L2 bus
Vin
GND
L2OVDD
GND
L2OVDD
V
JTAG signals
Vin
GND
OVDD
GND
OVDD
V
Die-junction temperature
Tj
0105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to Section 10.2, “Part
3. 2.0 V nominal.
4. 2.5 V nominal.
5. 3.3 V nominal.
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