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參數(shù)資料
| 型號： | MPC8240EC |
| 廠商： | Motorola, Inc. |
| 英文描述： | Integrated Processor Hardware Specifications |
| 中文描述： | 綜合處理器硬件規(guī)格 |
| 文件頁數(shù)： | 43/52頁 |
| 文件大?。?/td> | 1027K |
| 代理商： | MPC8240EC |
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MOTOROLA
MPC8240 Integrated Processor Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
43
System Design Information
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increased contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance, that is, the bare joint results
in a thermal resistance approximately seven times greater than that of the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 26). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, and
so on.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based on high conductivity and yet adequate mechanical strength to meet equipment
shock/vibration requirements. The following venders provide several commercially-available thermal
interfaces and adhesive materials:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
781-935-4850
800-248-2481
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
S
2
/
F
Freescale Semiconductor, Inc.
n
.
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| MPC8241LVR166D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR200D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LVR266D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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