參數(shù)資料
型號(hào): MRD6S18060MR1
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs
中文描述: 射頻功率場(chǎng)效應(yīng)晶體管N溝道增強(qiáng)型MOSFET的外側(cè)
文件頁數(shù): 16/20頁
文件大?。?/td> 694K
代理商: MRD6S18060MR1
16
RF Device Data
Freescale Semiconductor
MRF6S18060MR1 MRF6S18060MBR1
PACKAGE DIMENSIONS
CASE 1486-03
ISSUE C
TO-270 WB-4
PLASTIC
MRF6S18060MR1
DATUM
PLANE
BOTTOM VIEW
A1
E3
D1
E1
D3
E4
A2
NOTE 7
PIN 5
NOTE 8
A
B
C
H
DRAIN LEAD
D
A
M
aaa
C
b1
2X
D2
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M1994.
3. DATUM PLANE H IS LOCATED AT THE TOP OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE TOP OF THE PARTING LINE.
4. DIMENSIONS
D" AND
E1" DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS .006 PER SIDE. DIMENSIONS
D" AND
E1" DO
INCLUDE MOLD MISMATCH AND ARE DETER
MINED AT DATUM PLANE H.
5. DIMENSION
b1" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .005 TOTAL IN EXCESS
OF THE
b1" DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS A AND B TO BE DETERMINED AT
DATUM PLANE H.
7. DIMENSION A2 APPLIES WITHIN ZONE
J" ONLY.
8. HATCHING REPRESENTS THE EXPOSED AREA
OF THE HEAT SLUG.
c1
F
ZONE J
E2
E5
2X
A
DIM
A
A1
A2
D
D1
D2
D3
E
E1
E2
E3
E4
E5
MIN
.100
.039
.040
.712
.688
.011
.600
.551
.353
.132
.124
.270
.346
MAX
.104
.043
.042
.720
.692
.019
.559
.357
.140
.132
.350
MIN
2.54
0.99
1.02
18.08
17.48
0.28
15.24
MAX
2.64
1.09
1.07
18.29
17.58
0.48
14.2
9.07
3.56
3.35
8.89
MILLIMETERS
INCHES
14
8.97
3.35
3.15
6.86
8.79
F
b1
c1
e
aaa
.164
.007
.106 BSC
.004
.170
.011
4.17
0.18
2.69 BSC
0.10
4.32
0.28
.025 BSC
0.64 BSC
1
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. GATE
5. SOURCE
GATE LEAD
4X
e
2X
E
SEATING
PLANE
4
2
3
E5
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