參數(shù)資料
型號： MSC8103VT1100F
廠商： Freescale Semiconductor
文件頁數(shù)： 57/104頁
文件大?。?/td> 0K
描述： IC DSP 16BIT 275MHZ 332-FCPBGA
標(biāo)準(zhǔn)包裝： 90
系列： StarCore
類型： SC140 內(nèi)核
接口： 通信處理器模塊（CPM）
時(shí)鐘速率： 275MHz
非易失內(nèi)存： 外部
芯片上RAM： 512kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.60V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 332-BFBGA，F(xiàn)CPBGA
供應(yīng)商設(shè)備封裝： 332-FCBGA（17x17）
包裝： 托盤
MSC8103 Network Digital Signal Processor, Rev. 12
2-16
Freescale Semiconductor
Physical and Electrical Specifications
Table 2-17.
AC Timing for SIU Outputs
No.
Characteristic
Min.
Maximum2
Units
30 pF
50 pF
31a
TA delay from the 50% level of the DLLIN rising edge
Pipeline mode
Non-pipeline mode
1.0
5.0
4.0
6.5
5.5
ns
31b
TEA delay from the 50% level of the DLLIN rising edge
Pipeline mode
Non-pipeline mode
1.0
3.0
3.5
4.5
5.0
ns
31c
PSDVAL delay from the 50% level of the DLLIN rising edge
Pipeline mode
Non-pipeline mode
1.0
4.0
3.5
5.5
5.0
ns
32a
Address bus delay from the 50% level of the DLLIN rising edge
Multi master mode (SIUBCR[EBM] = 1)
Single master mode (SIUBCR[EBM] = 0)
1.0
6.3
5.5
7.8
7.0
ns
32b
Address attributes: TT/TBST/TSIZ/GBL delay from the 50% level of the DLLIN rising edge
1.0
5.5
7.0
ns
32c
BADDR delay from the 50% level of the DLLIN rising edge
1.0
3.5
5.0
ns
33a
Data bus delay from the 50% level of the DLLIN rising edge
Pipeline mode
Non-pipeline mode
1.0
5.0
6.0
6.5
7.5
ns
33b
DP delay from the 50% level of the DLLIN rising edge
Pipeline mode
Non-pipeline mode
1.0
4.0
6.5
5.5
8.0
ns
34
Memory controller signals/ALE delay from the 50% level of the DLLIN rising edge
1.0
5.5
7.0
ns
35a
DBG/BR/DBB delay from the 50% level of the DLLIN rising edge
1.0
4.0
5.5
ns
35b
AACK/ABB/CS delay from the 50% level of the DLLIN rising edge
1.0
4.5
6.0
ns
35c
BG delay from the 50% level of the DLLIN rising edge
1.0
4.0
5.5
ns
35d
TS delay from the 50% level of the DLLIN rising edge
1.0
3.5
5.0
ns
36
Delay from the 50% level of the DLLIN rising edge for all other signals
1.0
4.5
6.0
ns
Notes:
1.
The maximum bus frequency depends on the mode:
In 60x-compatible mode connected to another MSC8103 device, the frequency is determined by adding the input and output
longest timing values, which results in a frequency of 75 MHz for 30 pF output capacitance. In multi-master mode when
connected to another MSC8103 device, the frequency is determined by adding the input and output longest timing values,
which results in a frequency of 75 MHz for 30 pF output capacitance.
Certain bus modes, such as non-extra cycle (EXDD = 1), non-pipelined, and ECC/Parity modes, result in slower bus
frequencies.
In single-master mode, the frequency depends on the timing of the devices connected to the MSC8103.
2.
Output specifications are measured from the 50% level of the rising edge of DLLIN to the 50% level of the signal. Timings are
measured at the pin.
相關(guān)PDF資料
PDF描述
RBB10DHRD CONN CARD EXTEND 20POS .050"
VE-253-CW-F1 CONVERTER MOD DC/DC 24V 100W
EEC18DRXS CONN EDGECARD 36POS DIP .100 SLD
VE-25N-CW-F1 CONVERTER MOD DC/DC 18.5V 100W
EMM44DSXS CONN EDGECARD 88POS DIP .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8103VT1200F 功能描述:IC DSP 16BIT 300MHZ 332-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:StarCore 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
MSC81058 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81090 制造商:ASI 制造商全稱:ASI 功能描述:NPN SILICON RF POWER TRANSISTOR
MSC81111 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81118 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*