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參數(shù)資料
| 型號： | MSC8256TVT800B |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 0-BIT, OTHER DSP, PBGA783 |
| 封裝： | 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 |
| 文件頁數(shù)： | 18/68頁 |
| 文件大?。?/td> | 910K |
| 代理商： | MSC8256TVT800B |
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Electrical Characteristics
MSC8256 Six-Core Digital Signal Processor Data Sheet, Rev. 3
Freescale Semiconductor
25
Table 4 describes thermal characteristics of the MSC8256 for the FC-PBGA packages.
2.4
CLKIN Requirements
Table 5 summarizes the required characteristics for the CLKIN signal.
This section describes the DC electrical characteristics for the MSC8256.
2.5.1
DDR SDRAM DC Electrical Characteristics
This section describes the DC electrical specifications for the DDR SDRAM interface of the MSC8256.
Note:
DDR2 SDRAM uses VDDDDR(typ) = 1.8 V and DDR3 SDRAM uses VDDDDR(typ) = 1.5 V.
Table 4. Thermal Characteristics for the MSC8256
Characteristic
Symbol
FC-PBGA
29
× 29 mm2
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
18
12
°C/W
Junction-to-ambient, four-layer board1, 2
RθJA
13
9
°C/W
Junction-to-board (bottom)3
RθJB
5
°C/W
Junction-to-case4
RθJC
0.6
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC
specification for the specified package.
3.
Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for
the specified package.
4.
Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
Table 5. CLKIN Requirements
Parameter/Condition1
Symbol
Min
Typ
Max
Unit
Notes
CLKIN duty cycle
—
40
—
60
%
2
CLKIN slew rate
—
1
—
4
V/ns
3
CLKIN peak period jitter
—
±150
ps
—
CLKIN jitter phase noise at –56 dBc
—
500
KHz
4
AC input swing limits
ΔVAC
1.5
—
V
—
Input capacitance
CIN
——
15
pf
—
Notes:
1.
For clock frequencies, see the Clock chapter in the MSC8256 Reference Manual.
2.
Measured at the rising edge and/or the falling edge at VDDIO/2.
3.
Slew rate as measured from ±20% to 80% of voltage swing at clock input.
4.
Phase noise is calculated as FFT of TIE jitter.
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