參數(shù)資料
型號: MT18VDVF6472DG-265XX
元件分類: DRAM
英文描述: 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
封裝: DIMM-184
文件頁數(shù): 36/38頁
文件大?。?/td> 713K
代理商: MT18VDVF6472DG-265XX
PDF: 09005aef81c73825/Source: 09005aef81c73837
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF18C64_128x72D_2.fm - Rev. A 8/05 EN
7
2003, 2004, 2005 Micron Technology, Inc. All rights reserved.
512MB, 1GB: (x72, DR) 184-Pin DDR VLP RDIMM
Pin Assignments and Descriptions
Table 4:
Pin Descriptions
Pin numbers may not correlate with symbols; refer to Pin Assignment tables on page 6 for more information
Pin Numbers
Symbol
Type
Description
10
RESET#
Input
Asynchronously forces all registered ouputs LOW when RESET#
is LOW. This signal can be used during power-up to ensure CKE
is LOW and DQs are High-Z.
63, 65, 154
WE#, CAS#, RAS#
Input
Command Inputs: RAS#, CAS#, and WE# (along with S#) define
the command being entered.
137, 138
CK0, CK0#
Input
Clock: CK, CK# are differential clock inputs. All address and
control input signals are sampled on the crossing of the positive
edge of CK,and negative edge of CK#. Output data (DQ and
DQS) is referenced to the crossings of CK and CK#.
21,111
CKE0, CKE1
Input
Clock Enable: CKE HIGH activates and CKE LOW deactivates the
internal clock, input buffers and output drivers. Taking CKE
LOW provides PRECHARGE POWER-DOWN and SELF REFRESH
operations (all device banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any device bank). CKE is synchronous for
POWER-DOWN entry and exit, and for SELF REFRESH entry. CKE
is asynchronous for SELF REFRESH exit and for disabling the
outputs. CKE must be maintained HIGH throughout read and
write accesses. Input buffers (excluding CK, CK# and CKE) are
disabled during POWER-DOWN. Input buffers (excluding CKE)
are disabled during SELF REFRESH. CKE is an SSTL_2 input but
will detect an LVCMOS LOW level after VDD is applied.
157, 158
S0#, S1#
Input
Chip Selects: S# enables (registered LOW) and disables
(registered HIGH) the command decoder. All commands are
masked when S# is registered HIGH. S# is considered part of the
command code.
52, 59
BA0, BA1
Input
Bank Address: BA0 and BA1 define to which device bank an
ACTIVE, READ, WRITE, or PRECHARGE command is being
applied.
27, 29, 32, 37, 41, 43, 48,
115, 118, 122, 125, 130,
141
A0–A12
Input
Address Inputs: Provide the row address for ACTIVE commands,
and the column address and auto precharge bit (A10) for READ/
WRITE commands, to select one location out of the memory
array in the respective device bank. A10 sampled during a
PRECHARGE command determines whether the PRECHARGE
applies to one device bank (A10 LOW, device bank selected by
BA0, BA1) or all device banks (A10 HIGH). The address inputs
also provide the op-code during a MODE REGISTER SET
command. BA0 and BA1 define which mode register (mode
register or extended mode register) is loaded during the LOAD
MODE REGISTER command.
97, 107, 119, 129, 140,
149, 159, 169, 177
DM0–DM8
Input
Data Write Mask: DM LOW allows WRITE operation. DM HIGH
blocks WRITE operation. DM state does not affect READ
command.
5, 14, 25, 36, 47, 56, 67,
78, 86
DQS0–DQS8
Input/
Output
Data Strobe: Output with READ data, input with WRITE data.
DQS is edge-aligned with READ data, centered in WRITE data.
Used to capture data.
44, 45, 49, 51, 134, 135,
142, 144
CB0–CB7
Input/
Output
Check Bits.
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