- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄367800 > PC755 (Atmel Corp.) PowerPC 755/745 RISC Microprocessor PDF資料下載
參數(shù)資料
| 型號： | PC755 |
| 廠商： | Atmel Corp. |
| 英文描述： | PowerPC 755/745 RISC Microprocessor |
| 中文描述： | RISC微處理器PowerPC的745分之755 |
| 文件頁數(shù)： | 20/50頁 |
| 文件大?。?/td> | 1064K |
| 代理商： | PC755 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁當前第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁
20
PC755/745
2138D–HIREL–06/03
Adhesives and Thermal
Interface Materials
Figure 8.
Thermal Performance of Select Thermal Interface Material
A thermal interface material is recommended at the package lid-to-heat sink interface to
minimize the thermal contact resistance. For those applications where the heat sink is
attached by spring clip mechanism, Figure 8 shows the thermal performance of three
thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint,
and a joint with thermal grease as a function of contact pressure. As shown, the perfor-
mance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately 7 times greater than the ther-
mal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-
circuit board (see Figure 7). This spring force should not exceed 5.5 pounds of force.
Therefore, the synthetic grease offers the best thermal performance, considering the
low interface pressure.
The board designer can choose between several types of thermal interface. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as
follows:
T
j
= T
a
+ T
r
+ (
θ
jc
+
θ
int
+
θ
sa
) * P
d
Where
:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
0
0.5
1
1.5
2
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
S
0
10
20
30
40
50
60
70
80
相關PDF資料 |
PDF描述 |
|---|---|
| PC755M8 | PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module |
| PC755CMGHU300LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGHU350LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGHU366LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGHU400LE | PowerPC 755/745 RISC Microprocessor |
相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC755BMGH300LE | 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 300MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH300LE - Trays |
| PC755BMGH350LE | 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 350MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH350LE - Trays |
| PC755BMGH366LE | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 366MHZ 2.5V/3.3V 360HITCE CBGA - Trays |
| PC755BMGSU300LE | 制造商:e2v Aerospace & Defense 功能描述:300MHZ, 2.0V, CICGA, MIL TEMP |
| PC755BMGU300LE | 制造商:e2v technologies 功能描述:PC755BMGU300LE - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。