參數(shù)資料
型號(hào): PC755
廠商: Atmel Corp.
英文描述: PowerPC 755/745 RISC Microprocessor
中文描述: RISC微處理器PowerPC的745分之755
文件頁(yè)數(shù): 7/50頁(yè)
文件大?。?/td> 1064K
代理商: PC755
7
PC755/745
2138D–HIREL–06/03
Figure 3 (in part A) shows the pinout of the PC755, 360 PBGA packages as viewed from
the top surface. Part B shows the side profile of the PBGA package to indicate the direc-
tion of the top surface view.
Figure 3.
Pinout of the PC755, 360 PBGA, CBGA and CI-CGA Packages as Viewed
from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1 2 3
4
5 6 7 8
9 10 11 12 13 14 15 16
Not to Scale
17 18 19
View
Die
Substrate Assembly
Encapsulant
Part B
Part A
相關(guān)PDF資料
PDF描述
PC755M8 PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module
PC755CMGHU300LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU366LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU400LE PowerPC 755/745 RISC Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC755BMGH300LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 300MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH300LE - Trays
PC755BMGH350LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 350MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH350LE - Trays
PC755BMGH366LE 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 366MHZ 2.5V/3.3V 360HITCE CBGA - Trays
PC755BMGSU300LE 制造商:e2v Aerospace & Defense 功能描述:300MHZ, 2.0V, CICGA, MIL TEMP
PC755BMGU300LE 制造商:e2v technologies 功能描述:PC755BMGU300LE - Trays