參數(shù)資料
型號(hào)： PC755
廠商： Atmel Corp.
英文描述： PowerPC 755/745 RISC Microprocessor
中文描述： RISC微處理器PowerPC的745分之755
文件頁(yè)數(shù)： 37/50頁(yè)
文件大?。?/td> 1064K
代理商： PC755
37
PC755/745
2138D–HIREL–06/03
Preparation for Delivery
Packaging
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
Certificate of Compliance
Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-
ucts are in compliance either with MIL-PRF-883 and guarantying the parameters not
tested at temperature extremes for the entire temperature range.
Handling
MOS devices must be handled with certain precautions to avoid damage due to accu-
mulation of static charge. Input protection devices have been designed in the chip to
minimize the effect of static buildup. However, the following handling practices are
recommended:
1.
Devices should be handled on benches with conductive and grounded surfaces.
2.
Ground test equipment, tools and operator.
3.
Do not handle devices by the leads.
4.
Store devices in conductive foam or carriers.
5.
Avoid use of plastic, rubber, or silk in MOS areas.
6.
Maintain relative humidity above 50 percent if practical.
7.
For CI-CGA packages, use specific tray to take care of the highest height of the
package compared with the normal CBGA.
Package Mechanical
Data
The following sections provide the package parameters and mechanical dimensions for
the PC745, 255 PBGA package as well as the PC755, 360 CBGA and PBGA packages.
While both the PC755 plastic and the ceramic packages are described here, both pack-
ages are not guaranteed to be available at the same time. All new designs should allow
for either ceramic or plastic BGA packages for this device. For more information on
designing a common footprint for both plastic and ceramic package types, please con-
tact your local Motorola sales office.
Parameters for the
PC745
Package Parameters for the
PC745 PBGA
The package parameters are as provided in the following list. The package type is
21 x 21 mm, 255-lead plastic ball grid array (PBGA).
Mechanical Dimensions of the
PC745 PBGA Package
Figure 25 provides the mechanical dimensions and bottom surface nomenclature of the
PC745, 255 PBGA package.
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter (typical)
21 x 21 mm
255 (16 x 16 ball array – 1)
1.27 mm (50 mil)
2.25 mm
2.80 mm
0.75 mm (29.5 mil)
相關(guān)PDF資料
PDF描述
PC755M8 PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module
PC755CMGHU300LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU366LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU400LE PowerPC 755/745 RISC Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC755BMGH300LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 300MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH300LE - Trays
PC755BMGH350LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 350MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH350LE - Trays
PC755BMGH366LE 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 366MHZ 2.5V/3.3V 360HITCE CBGA - Trays
PC755BMGSU300LE 制造商:e2v Aerospace & Defense 功能描述:300MHZ, 2.0V, CICGA, MIL TEMP
PC755BMGU300LE 制造商:e2v technologies 功能描述:PC755BMGU300LE - Trays
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