參數(shù)資料
型號(hào)： PC755
廠商： Atmel Corp.
英文描述： PowerPC 755/745 RISC Microprocessor
中文描述： RISC微處理器PowerPC的745分之755
文件頁數(shù)： 46/50頁
文件大?。?/td> 1064K
代理商： PC755
46
PC755/745
2138D–HIREL–06/03
In addition, it is recommended that there be several bulk storage capacitors distributed
around the PCB, feeding the
V
DD
, L2O
V
DD
, and OV vplanes, to enable quick recharging
of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent
series resistance) rating to ensure the quick response time necessary. They should also
be connected to the power and ground planes through two vias to minimize inductance.
Suggested bulk capacitors – 100-330 μF (AVX TPS tantalum or Sanyo OSCON).
Connection
Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an
appropriate signal level through a resistor. Unused active low inputs should be tied to
O
V
DD
. Unused active high inputs should be connected to GND. All NC (no-connect) sig-
nals must remain unconnected.
Power and ground connections must be made to all external
V
DD
, O
V
DD
, L2O
V
DD
, and
GND pins of the PC755.
Output Buffer DC Impedance
The PC755 60x and L2 I/O drivers are characterized over process, voltage, and temper-
ature. To measure Z
0
, an external resistor is connected from the chip pad to (L2)OV
DD
or
GND. Then, the value of each resistor is varied until the pad voltage is (L2)O
V
DD
/2 (See
Figure 33).
The output impedance is the average of two components, the resistances of the pull-up
and pull-down devices. When Data is held low, SW2 is closed (SW1 is open), and R
N
is
trimmed until the voltage at the pad equals (L2)O
V
DD
/2. R
N
then becomes the resistance
of the pull-down devices. When Data is held high, SW1 is closed (SW2 is open), and R
P
is trimmed until the voltage at the pad equals (L2)O
V
DD
/2. R
P
then becomes the resis-
tance of the pull-up devices.
NO TAG describes the driver impedance measurement circuit described above.
Figure 32.
Driver Impedance Measurement Circuit
(L2)OV
DD
OGND
R
P
R
N
Pad
Data
SW1
SW2
(L2)OV
DD
相關(guān)PDF資料
PDF描述
PC755M8 PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module
PC755CMGHU300LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU366LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU400LE PowerPC 755/745 RISC Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC755BMGH300LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 300MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH300LE - Trays
PC755BMGH350LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 350MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH350LE - Trays
PC755BMGH366LE 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 366MHZ 2.5V/3.3V 360HITCE CBGA - Trays
PC755BMGSU300LE 制造商:e2v Aerospace & Defense 功能描述:300MHZ, 2.0V, CICGA, MIL TEMP
PC755BMGU300LE 制造商:e2v technologies 功能描述:PC755BMGU300LE - Trays
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