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參數(shù)資料
| 型號： | PCX7447AVGH1000NB |
| 廠商： | Atmel |
| 文件頁數(shù)： | 4/52頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 32BIT 1000MHZ 360CBGA |
| 標(biāo)準(zhǔn)包裝： | 44 |
| 處理器類型： | PowerPC 32-位 RISC |
| 速度： | 1.0GHz |
| 電壓： | 1.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-CBBGA 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 360-CBGA（25x25） |
| 包裝： | 托盤 |
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12
0833E–HIREL–01/07
PC7447A
e2v semiconductors SAS 2007
Figure 6-2.
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Note the internal versus external package resistance.
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-
air convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be
neglected for a first-order analysis. Thus, the thermal interface material and the heat sink conduc-
tion/convective thermal resistances are the dominant terms.
6.4.3
Thermal Management Information
This section provides thermal management information for the high coefficient of the thermal expansion
ceramic ball grid array (HITCE) package for air-cooled applications. Proper thermal control design is pri-
marily dependent on the system-level design – the heat sink, airflow, and thermal interface material. The
PC7447A implements several features designed to assist with thermal management, including DFS and
the temperature diode. DFS reduces the power consumption of the device by reducing the core fre-
quency; see Table 6-6 on page 19 for specific information regarding power reduction and DFS. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see section “Temperature Diode” on page 16 for more
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several methods
– spring clips to holes in the printed-circuit board or package, and mounting clips and screw assembly
(see Figure 6-3); however, due to the potentially large mass of the heat sink, attachment through the
printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed ten pounds.
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed-Circuit Board
Radiation
Convection
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCX7447AVGH1167NB | 功能描述:IC MPU 32BIT 1167MHZ 360CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點(diǎn):全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤 |
| PCX7448MGH1000NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
| PCX7448MGH1250NC | 制造商:e2v technologies 功能描述:PCX7448MGH1250NC - Trays |
| PCX7448VGH1000NC | 制造商:e2v technologies 功能描述:PCX7448VGH1000NC - Trays |
| PCX7448VGH1250NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1.25GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
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