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| 型號(hào)： | TS8308500VGL |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類(lèi)： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, CBGA68 |
| 封裝： | 11 X 11 MM, 1.27MM PITCH, CERAMIC, BGA-68 |
| 文件頁(yè)數(shù)： | 39/50頁(yè) |
| 文件大小： | 491K |
| 代理商： | TS8308500VGL |
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44
TS8308500
2193A–BDC–04/03
Thermal And
Moisture
Characteristics
Thermal Resistance
from Junction to
Ambient: RTHJA
The following table lists the convection thermal performances parameters of the device itself,
with no external heatsink added.
Thermal Resistance
from Junction to
Case: RTHJC
The typical value for Rthjc is given as 6.7
°C/W (8°C/W max).
This value does not include thermal contact resistance between package and external compo-
nent (heatsink or PC Board).
As an example, 2.0
°C/W can be taken for 50 m of thermal grease.
CBGA68 Board
Assembly with
External Heatsink
It is recommended that an external heatsink or specifically designed PCB be used. Cooling
system efficiency can be monitored using the Temperature Sensing Diode, integrated in the
device.
Figure 51. CBGA68 Board Assembly
Note:
Units = mm
Table 9. Thermal Resistance
Air Flow (m/s)
Estimated ja Thermal Resistance (
°C/W)
045
0.5
35.8
1
30.8
1.5
27.4
2
24.9
2.5
23
3
21.5
4
19.3
5
17.7
0
10
20
30
40
50
01
2
34
5
Air Flow (m/s)
Rthja
(deg.C/W)
31
32.5
Board
50.5
20.2
24.2
6.8
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