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參數(shù)資料
| 型號： | TS83102G0BMGS |
| 廠商： | ATMEL CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152 |
| 封裝： | HERMATIC, CI-CGA-152 |
| 文件頁數(shù)： | 8/52頁 |
| 文件大?。?/td> | 1548K |
| 代理商： | TS83102G0BMGS |
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16
5360A–BDC–06/05
TS83102G0BMGS
Figure 5-1.
Black Anodized Aluminium Heat Sink Glued on a Copper Base Screwed on Board (all dimensions in mm)
Note:
The cooling system efficiency can be monitored using the temperature sensing diodes, integrated
in the device. Refer to ”DECB/DIODE: Junction Temperature Monitoring and Output Decimation
5.2
Thermal Dissipation by Conduction Only
When the external heat sink cannot be used, the relevant thermal resistance is the thermal
resistance from the junction to the bottom of the columns: RTH
J-Bottom-of-columns.
The thermal path, in this case, is the junction, then the silicon, glue, CuW heat spreader, pack-
age Al2O3, and the columns (Sn10Pb90).
The Finite Element Method (FEM) with the thermal simulator leads to
RTH
J-bottom-of-columns = 7.4°C/W. This value assumes pure conduction from the junction to the bot-
tom of the columns (this is the worst case, no radiation and no convection is applied). With such
an assumption, RTH
J- Bottom-of-columns is user-independent.
To complete the thermal analysis, you must add the thermal resistance from the top of the board
(on which the device is soldered) to the ambient resistance, whose values are user-dependent
(the type of board, thermal, routing, area covered by copper in each board layer, thickness, air-
flow or cold plate are all parameters to consider).
In the case of the CI-CGA 152 package, the thermal resistance from the junction to the top of the
package (via the CuW heat spreader covered by AI203) is
RTH
J-top-of-package = 4.8°C/W.
16 x 50
11.5 x 52
18.50
6.5
Board
0.3
2
50 x 50
50 x 52
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TS83102G0BVGL | 制造商:e2v technologies 功能描述:ADC SGL 2GSPS 10-BIT PARALLEL 152CBGA - Trays |
| TS83102G0CGL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog to Digital Converter |
| TS83102G0GSZR5 | 制造商:e2v technologies 功能描述:TS83102G0GSZR5 - Trays |
| TS831-3I | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:MICROPOWER VOLTAGE SUPERVISOR RESET ACTIVE LOW |
| TS831-3ID | 功能描述:監(jiān)控電路 2.71V Micropower AL RoHS:否 制造商:STMicroelectronics 監(jiān)測電壓數(shù): 監(jiān)測電壓: 欠電壓閾值: 過電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel |
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