![](http://datasheet.mmic.net.cn/390000/TVP3409-170_datasheet_16839170/TVP3409-170_45.png)
A–1
Appendix A
Application Information
Board Layout
Careful configuration and placement of supply planes, components, and signal traces ensure a low-noise
board. This helps ensure proper functionality and low signal emissions in restricted frequency bands as
mandated by regulatory agencies.
A 4-layer PC board with separate power and ground planes should result in a board with quieter signals and
supplies.
The TVP3409 should be placed close to the video output connector and between the video output connector
and the edge card connector (see Figure A–1). This keeps the high-speed DAC output traces short and
minimizes the amount of circuitry between the RAMDAC and the supply terminals on the edge card
connector.
Power Distribution
Separate the power plane into digital and analog areas as illustrated in Figure A–1, A–4, A–5, and A–6. Place
all digital components over the digital plane and all analog components over the analog plane. The analog
components include the RAMDAC, reference circuitry, comparators, all mixed-signal devices, and any
passive support components for analog circuits.
The analog and digital power planes should be connected with at least one ferrite bead across the
separation as illustrated in Figures A-1. This bead provides resistance to high frequency currents. Select
a ferrite bead with an impedance curve suitable for your design. The ferrite should have a resistance at a
higher frequency than the maximum signal frequency on the PC board but lower than the second harmonic
(2X) of that frequency. The following beads provide resistances of approximately 75
at 100 MHz,
Ferroxcube VK20019-4B, Fair-Rite 2743001111, or Philips 431202036690. The power and ground traces
to the RAMDAC should be at least 50 mils wide. This is especially important on the TVP3409 because the
device has only two V
CC
terminals.
RAMDAC
Analog 5 V
Keep Distance
Short
Video
Connector
Gap
Ferrite
Bead
Graphics
Controller
Digital 5 V
Figure A–1. Isolation of Digital V
CC
Supply from Analog V
CC
Supply
Decoupling Capacitors
All decoupling capacitors should be located within 0.25 inch of the device to be decoupled. Chip capacitors
are recommended, but radial and axial leads can work. Keep lead lengths as short as possible to reduce
inductance and electromagnetic interference (EMI). For leaded capacitors, use devices with a
self-resonance above the pixel clock frequency.