參數(shù)資料
型號(hào): UPD754244GS-XXX-GJG
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PDSO20
封裝: 0.300 INCH, 0.65 MM PITCH, PLASTIC, SSOP-20
文件頁(yè)數(shù): 79/90頁(yè)
文件大?。?/td> 602K
代理商: UPD754244GS-XXX-GJG
PD754144, 754244
78
Data Sheet U10040EJ2V1DS
17. RECOMMENDED SOLDERING CONDITIONS
The
PD754144 and PD754244 should be soldered and mounted under the following recommended
conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 17-1. Surface Mounting Type Soldering Conditions (1/3)
(1)
PD754244GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max. (at 210°C or higher), IR35-00-2
Count: Twice or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max. (at 200°C or higher), VP15-00-2
Count: Twice or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once
WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
Caution
Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
(2)
PD754144GS-xxx-GJG: 20-pin plastic shrink SOP (300 mil, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max. (at 210°C or higher), IR35-00-3
Count: Three times or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max. (at 200°C or higher), VP15-00-3
Count: Three times or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once
WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
Caution
Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
相關(guān)PDF資料
PDF描述
UPD75P3018AGK-9EU Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No
UPD75P3018AGK-BE9 LJT 46C 40#20 4#16 2#8(COAX)
UPD780023AGK-xxx-9ET Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No
UPD78011HGK-XXX-8A8 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64
UPD78053GC-XXX-8BT 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQFP80
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD7554AG-597-E2 制造商:Renesas Electronics Corporation 功能描述:
UPD7554AG-597-E2-A 制造商:Renesas Electronics Corporation 功能描述:
UPD7554AG-603-E2 制造商:Renesas Electronics Corporation 功能描述:
UPD7554AG-603-E2-A 制造商:Renesas Electronics Corporation 功能描述:
UPD7554AG-611-E2 制造商:Renesas Electronics Corporation 功能描述: