參數(shù)資料
型號(hào): W25Q80BVSNAP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù): 31/75頁
文件大?。?/td> 1055K
代理商: W25Q80BVSNAP
W25Q80BV
Publication Release Date: October 06, 2010
- 37 -
Revision D
9.2.18 Set Burst with Wrap (77h)
The Set Burst with Wrap (77h) instruction is used in conjunction with “Fast Read Quad I/O” and “Word
Read Quad I/O” instructions to access a fixed length of 8/16/32/64-byte section within a 256-byte page.
Certain applications can benefit from this feature and improve the overall system code execution
performance.
Similar to a Quad I/O instruction, the Set Burst with Wrap instruction is initiated by driving the /CS pin low
and then shifting the instruction code “77h” followed by 24 dummy bits and 8 “Wrap Bits”, W7-0. The
instruction sequence is shown in figure 17. Wrap bit W7 and the lower nibble W3-0 are not used.
W4 = 0
W4 =1 (DEFAULT)
W6, W5
Wrap Around
Wrap Length
Wrap Around
Wrap Length
0 0
Yes
8-byte
No
N/A
0 1
Yes
16-byte
No
N/A
1 0
Yes
32-byte
No
N/A
1 1
Yes
64-byte
No
N/A
Once W6-4 is set by a Set Burst with Wrap instruction, all the following “Fast Read Quad I/O” and “Word
Read Quad I/O” instructions will use the W6-4 setting to access the 8/16/32/64-byte section within any
page. To exit the “Wrap Around” function and return to normal read operation, another Set Burst with
Wrap instruction should be issued to set W4 = 1. The default value of W4 upon power on is 1. In the case
of a system Reset while W4 = 0, it is recommended that the controller issues a Set Burst with Wrap
instruction to reset W4 = 1 prior to any normal Read instructions since W25Q80BV does not have a
hardware Reset Pin.
Wrap Bit
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
2
3
4
5
X
don't
care
6
7
8
9
don't
care
don't
care
10
11
12
13
14
15
Instruction (77h)
Mode 0
Mode 3
X
w4
X
w5
X
w6
X
Figure 17. Set Burst with Wrap Instruction Sequence
相關(guān)PDF資料
PDF描述
WV3EG128M72EFSR262D3MG 128M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
W7NCF08GH10CS4FM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA5DM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10IS8BM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10ISA4HM1G FLASH 3.3V PROM MODULE, XMA50
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q80BVSNIG 功能描述:IC SPI FLASH 8MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,000 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 異步 存儲(chǔ)容量:256K (32K x 8) 速度:15ns 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:28-TSSOP(0.465",11.8mm 寬) 供應(yīng)商設(shè)備封裝:28-TSOP 包裝:帶卷 (TR) 其它名稱:71V256SA15PZGI8
W25Q80BVSNIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC
W25Q80BVSNIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80BVSSAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80BVSSAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI