參數(shù)資料
型號: XA3S400A-4FTG256Q
廠商: Xilinx Inc
文件頁數(shù): 50/57頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3A 400K 256FTBGA
產(chǎn)品培訓(xùn)模塊: Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝: 1
系列: Spartan®-3A XA
LAB/CLB數(shù): 896
邏輯元件/單元數(shù): 8064
RAM 位總計: 368640
輸入/輸出數(shù): 195
門數(shù): 400000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FTBGA
XA Spartan-3A Automotive FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
54
Byte Peripheral Interface Configuration Timing
X-Ref Target - Figure 15
Figure 15: Waveforms for BPI Configuration
Table 53: Timing for BPI Configuration Mode
Symbol
Description
Minimum
Maximum
Units
TCCLK1
Initial CCLK clock period
TCCLKn
CCLK clock period after FPGA loads ConfigRate setting
TMINIT
Setup time on M[2:0] mode pins before the rising edge of INIT_B
50
–ns
TINITM
Hold time on M[2:0] mode pins after the rising edge of INIT_B
0
–ns
TINITADDR
Minimum period of initial A[25:0] address cycle; LDC[2:0] and HDC are asserted
and valid
55
TCCLK1
cycles
TCCO
Address A[25:0] outputs valid after CCLK falling edge
TDCC
Setup time on D[7:0] data inputs before CCLK rising edge
See TSMDCC in Table 50
TCCD
Hold time on D[7:0] data inputs after CCLK rising edge
0
–ns
(Input)
PUDC_B must be stable before INIT_B goes High and constant throughout the configuration process.
Data
Address
Data
Address
Byte 0
000_0000
INIT_B
<0:1:0>
M[2:0]
T
MINIT
T
INITM
LDC[2:0]
HDC
CSO_B
Byte 1
000_0001
CCLK
A[25:0]
D[7:0]
T
DCC
T
CCD
T
AVQV
T
CCLK1
(Input)
T
INITADDR
T
CCLKn
T
CCLK1
T
CCO
PUDC_B
New ConfigRate active
Pin initially pulled High by internal pull-up resistor if PUDC_B input is Low.
Pin initially high-impedance (Hi-Z) if PUDC_B input is High.
Mode input pins M[2:0] are sampled when INIT_B goes High. After this point,
input values do not matter until DONE goes High, at which point the mode pins
become user-I/O pins.
(Input)
PROG_B
(Input)
DS681_14_041111
(Open-Drain)
Shaded values indicate specifications on attached parallel NOR Flash PROM.
相關(guān)PDF資料
PDF描述
RSC60DRYI-S734 CONN EDGECARD 120PS DIP .100 SLD
XC6SLX25-3FT256I IC FPGA SPARTAN 6 256FTGBGA
RMC60DRYI-S734 CONN EDGECARD 120PS DIP .100 SLD
RSC35DTEI CONN EDGECARD 70POS .100 EYELET
GCB105DHBS CONN EDGECARD 210PS R/A .050 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S500E 制造商:XILINX 制造商全稱:XILINX 功能描述:XA Spartan-3E Automotive FPGA Family Data Sheet
XA3S500E-4CPG132I 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S500E-4CPG132Q 功能描述:IC FPGA SPARTAN-3E 500K 132CSBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S500E-4FT256Q 功能描述:IC FPGA SPARTAN-3E 256FPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S500E-4FTG256I 功能描述:IC FPGA SPARTAN-3E 500K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)