參數(shù)資料
型號: XA3SD1800A-4FGG676I
廠商: Xilinx Inc
文件頁數(shù): 43/58頁
文件大?。?/td> 0K
描述: SPARTAN-3ADSP FPGA 1800K 676FBGA
產(chǎn)品培訓模塊: Extended Spartan 3A FPGA Family
標準包裝: 40
系列: Spartan®-3A DSP XA
LAB/CLB數(shù): 4160
邏輯元件/單元數(shù): 37440
RAM 位總計: 1548288
輸入/輸出數(shù): 519
門數(shù): 1800000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 676-BGA
供應商設備封裝: 676-FBGA(27x27)
配用: 122-1574-ND - KIT DEVELOPMENT SPARTAN 3ADSP
XA Spartan-3A DSP Automotive FPGA Family Data Sheet
DS705 (v2.0) April 18, 2011
Product Specification
48
Configuration and JTAG Timing
General Configuration Power-On/Reconfigure Timing
X-Ref Target - Figure 11
Figure 11: Waveforms for Power-On and the Beginning of Configuration
Table 46: Power-On Timing and the Beginning of Configuration
Symbol
Description
Device
Min
Max
Units
TPOR(2)
The time from the application of VCCINT, VCCAUX, and VCCO
Bank 2 supply voltage ramps (whichever occurs last) to the
rising transition of the INIT_B pin
All
–18
ms
TPROG
The width of the low-going pulse on the PROG_B pin
All
0.5
–s
TPL(2)
The time from the rising edge of the PROG_B pin to the
rising transition on the INIT_B pin
All
–2
ms
TINIT
Minimum Low pulse width on INIT_B output
All
300
–ns
TICCK(3)
The time from the rising edge of the INIT_B pin to the
generation of the configuration clock signal at the CCLK
output pin
All
0.5
4
s
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 8. This means power must be applied to all VCCINT, VCCO,
and VCCAUX lines.
2.
Power-on reset and the clearing of configuration memory occurs during this period.
3.
This specification applies only to the SPI and BPI modes.
4.
For details on configuration, see UG332, Spartan-3 Generation Configuration User Guide.
VCCINT
(Supply)
VCCAUX
VCCO Bank 2
PROG_B
(Output)
(Open-Drain)
(Input)
INIT_B
CCLK
DS705_11_041311
1.2V
2.5V
T
ICCK
T
PROG
T
PL
T
POR
1.0V
2.0V
3.3V
or
2.5V
3.3V
or
Notes:
1.
The VCCINT, VCCAUX, and VCCO supplies can be applied in any order.
2.
The Low-going pulse on PROG_B is optional after power-on.
3.
The rising edge of INIT_B samples the voltage levels applied to the mode pins (M0 – M2).
相關PDF資料
PDF描述
SST25VF020B-80-4I-QAE IC FLASH SER 2MB 80MHZ SPI 8WSON
XC6SLX75T-3FGG676C IC FPGA SPARTAN 6 74K 676FGGBGA
24AA256T-I/SM IC EEPROM 256KBIT 400KHZ 8SOIC
XC6SLX100-N3FGG676I IC FPGA SPARTAN-6 676FBGA
25C160T-E/SN IC EEPROM 16KBIT 3MHZ 8SOIC
相關代理商/技術參數(shù)
參數(shù)描述
XA3SD1800A-4FGG676Q 功能描述:SPARTAN-3ADSP FPGA 1800K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3SD3400A 制造商:XILINX 制造商全稱:XILINX 功能描述:XA Spartan-3A DSP Automotive FPGA Family Data Sheet
XA3SD3400A-4CSG484I 功能描述:SPARTAN-3ADSP FPGA 3400K 484CSBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3SD3400A-4FGG676I 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A DSP XA 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
X-A4A-300L 制造商:Leach International Corporation 功能描述:MID RANGE - Bulk