參數(shù)資料
型號: XRM48L950ZWTT
廠商: Texas Instruments
文件頁數(shù): 82/176頁
文件大?。?/td> 0K
描述: MCU 16/32Bit FLASH 3MB 337NFBGA
標準包裝: 1
系列: Hercules™ ARM® RM4x
應用: 工業(yè)安全,醫(yī)療
核心處理器: ARM? Cortex? - R4F
程序存儲器類型: 閃存(3MB)
控制器系列: RM4
RAM 容量: 256K x 8
接口: CAN,以太網(wǎng),I²C,LIN,MibSPI,SCI,SPI,USB
輸入/輸出數(shù): 120
電源電壓: 1.14 V ~ 3.6 V
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 337-LFBGA
包裝: 托盤
供應商設備封裝: 337-NFBGA(16x16)
其它名稱: 296-29390
PACKAGE OPTION ADDENDUM
www.ti.com
22-Feb-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
RM48L550PGET
ACTIVE
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
RM48
L550PGET
RM48L550ZWTT
ACTIVE
NFBGA
ZWT
337
90
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
RM48
L550ZWTT
RM48L750PGET
ACTIVE
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
RM48
L750PGET
RM48L750ZWTT
ACTIVE
NFBGA
ZWT
337
90
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
RM48
L750ZWTT
RM48L950PGET
ACTIVE
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
RM48
L950PGET
RM48L950ZWTT
ACTIVE
NFBGA
ZWT
337
90
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
RM48
L950ZWTT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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