參數(shù)資料
型號: XRT75R06DIB
廠商: EXAR CORP
元件分類: 數(shù)字傳輸電路
英文描述: SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
中文描述: DATACOM, PCM TRANSCEIVER, PBGA217
封裝: 23 X 23 MM, BGA-217
文件頁數(shù): 21/105頁
文件大?。?/td> 591K
代理商: XRT75R06DIB
á
SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
XRT75R06D
REV. 1.0.0
16
FUNCTIONAL DESCRIPTION
The XRT75R06D is a six channel fully integrated Line Interface Unit featuring EXAR’s R
3
Technology
(Reconfigurable, Relayless Redundancy) for E3/DS3/STS-1 applications. The LIU incorporates 6 independent
Receivers, Transmitters and Jitter Attenuators in a single 217 Lead BGA package. Each channel can be
independently programmed to support E3, DS-3 or STS-1 line rates using one input clock reference of
12.288MHz in Single Frequency Mode (SFM). The LIU is responsible for providing the physical connection
between a line interface and an aggregate mapper or framing device. Along with the analog-to-digital
processing, the LIU offers monitoring and diagnostic features to help optimize network design implementation.
A key characteristic within the network topology is Automatic Protection Switching (APS).
EXAR’s proven expertise in providing redundany solutions has paved the way for R
3
Technology.
1.0
R
3
TECHNOLOGY (RECONFIGURABLE, RELAYLESS REDUNDANCY)
Redundancy is used to introduce reliability and protection into network card design. The redundant card in
many cases is an exact replicate of the primary card, such that when a failure occurs the network processor
can automatically switch to the backup card. EXAR’s R
3
technology has re-defined E3/DS-3/STS-1 LIU design
for 1:1 and 1+1 redundancy applications. Without relays and one Bill of Materials, EXAR offers multi-port,
integrated LIU solutions to assist high density aggregate applications and framing requirements with reliability.
The following section can be used as a reference for implementing R
3
Technology with EXAR’s world leading
line interface units.
1.1
Network Architecture
A common network design that supports 1:1 or 1+1 redundancy consists of N primary cards along with N
backup cards that connect into a mid-plane or back-plane architecture without transformers installed on the
network cards. In addition to the network cards, the design has a line interface card with one source of
transformers, connectors, and protection components that are common to both network cards. With this
design, the bill of materials is reduced to the fewest amount of components. See Figure 3. for a simplified
block diagram of a typical redundancy design.
F
IGURE
3. N
ETWORK
R
EDUNDANCY
A
RCHITECTURE
Line Interface Card
Primary Line Card
Framer/
Mapper
LIU
Back
Plane
or
Mid
Plane
Tx
Rx
31.6
31.6
0.01
μ
F
0.01
μ
F
1:1
1:1
Redundant Line Card
Framer/
Mapper
LIU
Tx
Rx
31.6
31.6
0.01
μ
F
0.01
μ
F
37.5
37.5
GND
相關PDF資料
PDF描述
XRT75R06 SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
XRT75R06IB SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
XRT75R12D TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
XRT75R12DIB TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
XRT75R12 TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
相關代理商/技術參數(shù)
參數(shù)描述
XRT75R06DIB-F 功能描述:網(wǎng)絡控制器與處理器 IC 6 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
XRT75R06ES 功能描述:時鐘合成器/抖動清除器 6CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R06IB 功能描述:外圍驅動器與原件 - PCI 6CH E3/DS3/STS1 LIU+Jitter Attenuato RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R06IB208 制造商:Exar Corporation 功能描述:Line Interface Unit 51.84Mbps DS3/E3/STS-1 Parallel 217-Pin BGA
XRT75R06IB-F 功能描述:外圍驅動器與原件 - PCI 6 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray