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參數(shù)資料
| 型號： | μPD29F008AL-X |
| 廠商： | NEC Corp. |
| 英文描述： | 8 M-Bit CMOS Low Voltage Flash Memory(8M CMOS低壓閃存) |
| 中文描述： | 8 m位的CMOS低電壓快閃記憶體（800萬的CMOS低壓閃存） |
| 文件頁數(shù)： | 6/44頁 |
| 文件大?。?/td> | 249K |
| 代理商： | ΜPD29F008AL-X |
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Preliminary Data Sheet
6
μ
PD29F008AL-X
Contents
1. Input / Output Pin Function ................................................................................................................. 7
2. Sector Configuration / Sector Address Table ................................................................................... 8
3. Bus Operations .................................................................................................................................. 10
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
Read ............................................................................................................................................................ 10
Write ............................................................................................................................................................ 10
Standby ....................................................................................................................................................... 10
Output Disable ........................................................................................................................................... 10
Hardware Reset .......................................................................................................................................... 11
Sector Protect ............................................................................................................................................ 11
Temporary Sector Unprotect ................................................................................................................... 13
Read Product ID Code ............................................................................................................................... 13
4. Commands .......................................................................................................................................... 14
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Writing Commands .................................................................................................................................... 14
Read / Reset ............................................................................................................................................... 15
Read Product ID Code ............................................................................................................................... 15
Program ...................................................................................................................................................... 15
Chip Erase .................................................................................................................................................. 16
Sector Erase ............................................................................................................................................... 16
Erase Suspend / Resume .......................................................................................................................... 17
Unlock Bypass .......................................................................................................................................... 17
4.8.1
Unlock Bypass Set ......................................................................................................................... 17
4.8.2
Unlock Bypass Program ................................................................................................................ 17
4.8.3
Unlock Bypass Reset ..................................................................................................................... 17
Sector Protect (By Command Input) ........................................................................................................ 19
4.10 Sector Unprotect ........................................................................................................................................ 20
4.9
5. Hardware Sequence Flags ................................................................................................................ 22
5.1
5.2
5.3
5.4
5.5
5.6
I/O7 (Data Polling) ...................................................................................................................................... 22
I/O6 (Toggle Bit) ......................................................................................................................................... 24
I/O2 (Toggle Bit II) ...................................................................................................................................... 25
I/O5 (Exceeding Timing Limits) ................................................................................................................ 25
I/O3 (Sector Erase Timer) .......................................................................................................................... 25
RY (/BY) (Ready / Busy) ............................................................................................................................. 26
6. Hardware Data Protection ................................................................................................................. 27
6.1
6.2
6.3
Low V
CC
Write Inhibit ................................................................................................................................. 27
Logical Inhibit ............................................................................................................................................ 27
Power-Up Write Inhibit .............................................................................................................................. 27
7. Electrical Characteristics .................................................................................................................. 28
8. Package Drawings ............................................................................................................................. 39
9. Recommended Soldering Conditions .............................................................................................. 41
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