3-4 Revision 11 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These" />
參數(shù)資料
型號： A3PN250-ZVQG100
廠商： Microsemi SoC
文件頁數(shù)： 105/114頁
文件大?。?/td> 0K
描述： IC FPGA NANO 250K GATES 100-VQFP
標(biāo)準(zhǔn)包裝： 90
系列： ProASIC3 nano
RAM 位總計： 36864
輸入/輸出數(shù)： 68
門數(shù)： 250000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 100-TQFP
供應(yīng)商設(shè)備封裝： 100-VQFP（14x14）
Pin Descriptions and Packaging
3-4
Revision 11
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
相關(guān)PDF資料
PDF描述
A3PN250-ZVQ100 IC FPGA NANO 250K GATES 100-VQFP
BR93L46F-WE2 IC EEPROM 1KBIT 2MHZ 8SOP
AGLN030V2-ZCSG81I IC FPGA NANO 1KB 30K 81-CSP
A3P125-1VQ100 IC FPGA 1KB FLASH 125K 100-VQFP
A3P125-1VQG100 IC FPGA 1KB FLASH 125K 100-VQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PN250-ZVQG100I 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
A3PT5012 制造商:OMRON AUTOMATION AND SAFETY 功能描述:2 SPLIT SCREEN HORZ 制造商:OMRON INDUSTRIAL AUTOMATION 功能描述:Heavy Duty Switches L.P.B.
A3PT-5012 功能描述:按鈕開關(guān) L.P.B. RoHS:否 制造商:C&K Components 觸點形式:2 NC - 2 NO 開關(guān)功能:ON ? OFF 電流額定值:4 A 電壓額定值 AC:12 V to 250 V 電壓額定值 DC:12 V to 50 V 功率額定值: 安裝風(fēng)格:Through Hole 照明:Illuminated 照明顏色:None IP 等級:IP 40 端接類型:Solder 觸點電鍍:Silver 執(zhí)行器:Square 蓋顏色: 封裝: 可燃性等級:UL 94 V-0
A3PT70402 制造商:OMRON AUTOMATION AND SAFETY 功能描述:SWITCH UNIT 制造商:OMRON INDUSTRIAL AUTOMATION 功能描述:Switch Push Button Round Button 5A 250VAC 250VDC Alternate Contact Quick Connect/Solder Panel Mount
A3PT-7040-2 功能描述:按鈕開關(guān) L.P.B. RoHS:否 制造商:C&K Components 觸點形式:2 NC - 2 NO 開關(guān)功能:ON ? OFF 電流額定值:4 A 電壓額定值 AC:12 V to 250 V 電壓額定值 DC:12 V to 50 V 功率額定值: 安裝風(fēng)格:Through Hole 照明:Illuminated 照明顏色:None IP 等級:IP 40 端接類型:Solder 觸點電鍍:Silver 執(zhí)行器:Square 蓋顏色: 封裝: 可燃性等級:UL 94 V-0
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