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參數(shù)資料
| 型號： | BGY288 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | Power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 and PCS1900 |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | 8 X 8 MM, PLASTIC, SOT-775A, 16 PIN |
| 文件頁數(shù)： | 17/22頁 |
| 文件大?。?/td> | 140K |
| 代理商： | BGY288 |
9397 750 14011
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 2 February 2005
17 of 22
Philips Semiconductors
BGY288
Power amplifier with integrated control loop
12. Soldering Recommendations
12.1 Reflow profile
The BGY288 is a laminate-based power amplifier module in a Leadless Grid Array (LGA)
package. The module can be assembled using a standard Surface Mount Technology
(SMT) reflow process in a convection or IR-oven. The minimum and maximum limits of the
temperature profile are shown in
Figure 8
. The actual profile has to be within these limits,
and will depend on the printed-circuit board material, the number and size of the
components to be assembled, and the type of solder which is being used.
It is recommended to use a standard no-clean solder paste like SnPb for profiles having
leads containing solder, or SnAgCu for lead-free assembly processes. The parameters
and corresponding values for SnPb and SnAgCu solder are given in
Table 10
.
12.2 Printed-circuit board layout
The printed-circuit board footprint layout is a copy of the metal pattern on the underside of
the LGA package. It is recommended that the printed-circuit board is designed with a
large ground plane, and that the solder lands of the ground plane solder mask are defined
as shown in
Figure 9
.
Fig 8.
Recommended reflow temperature profile
Table 10:
Symbol
α
T
E
t
E
T
R
t
R
T
P
β
Reflow soldering parameters
parameter
temperature gradient
pre-heat (soak) temperature
pre-heat time
reflow temperature
reflow time
maximum peak temperature
temperature gradient
time 25
°
C to peak temperature
SnPb Solder
≤
3
100 to 150
60 to 120
> 183
60 to 150
240
< 5
6 minutes max.
SnAgCu solder
≤
3
150 to 200
60 to 180
> 217
60 to 150
260
< 5
8 minutes max.
Unit
°
C/s
°
C
s
°
C
s
°
C
°
C/s
001aaa705
t
E
T
P
T
R
T
E(max)
T
E(min)
t
R
t
temperature
α
α
β
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