參數(shù)資料
型號: BGY288
廠商: NXP SEMICONDUCTORS
元件分類: 衰減器
英文描述: Power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 and PCS1900
中文描述: 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
封裝: 8 X 8 MM, PLASTIC, SOT-775A, 16 PIN
文件頁數(shù): 22/22頁
文件大小: 140K
代理商: BGY288
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 2 February 2005
Document number: 9397 750 14011
Published in The Netherlands
Philips Semiconductors
BGY288
Power amplifier with integrated control loop
18. Contents
1
1.1
1.2
1.2.1
1.2.2
1.3
2
2.1
2.2
3
4
5
5.1
5.2
5.3
5.4
5.5
6
6.1
6.2
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
16
17
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General features. . . . . . . . . . . . . . . . . . . . . . . . 1
RF performance . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Operating conditions. . . . . . . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4
Control logic . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power controller . . . . . . . . . . . . . . . . . . . . . . . . 4
Mode control. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ramp-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ramp-down . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering Recommendations. . . . . . . . . . . . . 17
Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . 17
Printed-circuit board layout. . . . . . . . . . . . . . . 17
Stencil design . . . . . . . . . . . . . . . . . . . . . . . . . 18
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Moisture sensitivity level. . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Contact information . . . . . . . . . . . . . . . . . . . . 21
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