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Koninklijke Philips Electronics N.V. 2005
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consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 2 February 2005
Document number: 9397 750 14011
Published in The Netherlands
Philips Semiconductors
BGY288
Power amplifier with integrated control loop
18. Contents
1
1.1
1.2
1.2.1
1.2.2
1.3
2
2.1
2.2
3
4
5
5.1
5.2
5.3
5.4
5.5
6
6.1
6.2
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
16
17
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General features. . . . . . . . . . . . . . . . . . . . . . . . 1
RF performance . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Operating conditions. . . . . . . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4
Control logic . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power controller . . . . . . . . . . . . . . . . . . . . . . . . 4
Mode control. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ramp-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ramp-down . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering Recommendations. . . . . . . . . . . . . 17
Reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . 17
Printed-circuit board layout. . . . . . . . . . . . . . . 17
Stencil design . . . . . . . . . . . . . . . . . . . . . . . . . 18
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Moisture sensitivity level. . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Contact information . . . . . . . . . . . . . . . . . . . . 21