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參數(shù)資料
| 型號： | BGY288 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | Power amplifier with integrated control loop for GSM850, EGSM900, DCS1800 and PCS1900 |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | 8 X 8 MM, PLASTIC, SOT-775A, 16 PIN |
| 文件頁數(shù)： | 18/22頁 |
| 文件大?。?/td> | 140K |
| 代理商： | BGY288 |
9397 750 14011
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 2 February 2005
18 of 22
Philips Semiconductors
BGY288
Power amplifier with integrated control loop
12.3 Stencil design
The recommended dimensions of the solder stencil are given in
Figure 9
and are based
on a stencil thickness of 125
μ
m. Using a thinner or thicker stencil will require the stencil
aperture dimensions to be adjusted.
12.4 Rework
If rework is required, it is recommended that a BGA rework station with a programmable
top and bottom heater is used. The first step of the rework process is to pre-heat the
printed-circuit board with the bottom heater of the rework station. When the board has
reached the pre-heat temperature, the top heater can be used to increase the
temperature above the melting point of the solder. The component which has to be
replaced can be picked up with a vacuum nozzle. Before placing a new component the
remaining solder on the board must be removed. Fresh solder can be dispensed, a new
component placed, and the board heated as described previously.
12.5 Moisture sensitivity level
The BGY288 is tested according to the JEDEC standard JESD 22-A113C. The BGY288 is
classified on MSL3 for a lead soldering profile with a peak temperature of 240
°
C, and on
MSL4 for a lead-free soldering profile with a peak temperature of 260
°
C.
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