參數(shù)資料
型號(hào): COP8CBR9KMT8
廠商: National Semiconductor
文件頁(yè)數(shù): 8/111頁(yè)
文件大?。?/td> 0K
描述: IC MCU EEPROM 8BIT 32K 56-TSSOP
標(biāo)準(zhǔn)包裝: 34
系列: COP8™ 8C
核心處理器: COP8
芯體尺寸: 8-位
速度: 20MHz
連通性: Microwire/Plus(SPI),UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 49
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 1K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 56-TFSOP(0.240",6.10mm 寬)
包裝: 管件
其它名稱: *COP8CBR9KMT8
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
COP8CBR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-2A-245C-4
WEEK
-40 to 85
COP8CBR9HVA8
COP8CBR9IMT8/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
COP8CBR9IMT8
COP8CCR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-3-245C-168 HR
-40 to 125
COP8CCR9HVA8
COP8CCR9IMT7/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
-40 to 125
COP8CCR9IMT7
COP8CCR9IMT8/63SN
ACTIVE
TSSOP
DGG
48
1000
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
COP8CCR9IMT8
COP8CCR9IMT8/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
-40 to 125
COP8CCR9IMT8
COP8CCR9LVA7/63SN
ACTIVE
PLCC
FN
68
250
Green (RoHS
& no Sb/Br)
SN
Level-4-245C-72 HR
COP8CCR9LVA7
COP8CCR9LVA7/NOPB
ACTIVE
PLCC
FN
68
18
Green (RoHS
& no Sb/Br)
SN
Level-2A-245C-4
WEEK
-40 to 125
COP8CCR9LVA7
COP8CDR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-3-245C-168 HR
-40 to 85
COP8CDR9HVA8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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