參數(shù)資料
型號(hào): HYB18T256400AF
廠商: INFINEON TECHNOLOGIES AG
英文描述: 256 Mbi t DDR2 SDRAM
中文描述: 256姆噸DDR2內(nèi)存
文件頁(yè)數(shù): 8/90頁(yè)
文件大小: 1246K
代理商: HYB18T256400AF
Page 8 Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.4.3 Package Pinout for x16 components 84 pins, FBGA Package (top view)
1
2
3
7
8
9
VDD
NC
VSS
A
VSSQ
UDQS
VDDQ
UDQ6
VSSQ
UDM
B
UDQS
VSSQ
UDQ7
VDDQ
UDQ1
VDDQ
C
VDDQ
UDQ0
VDDQ
UDQ4
VSSQ
DQ3
D
UDQ2
VSSQ
UDQ5
VDD
NC
VSS
E
VSSQ
LDQS
VDDQ
LDQ6
VSSQ
LDM
F
LDQS
VSSQ
LDQ7
VDDQ
LDQ1
VDDQ
G
VDDQ
LDQ0
VDDQ
LDQ4
VSSQ
LDQ3
H
LDQ2
VSSQ
LDQ5
VDDL
VREF
VSS
J
VSSDL
CK
VDD
CKE
WE
K
RAS
CK
ODT
RFU
BA0
BA1
L
CAS
CS
A10
A1
M
A2
A0
VDD
VSS
A3
A5
N
A6
A4
A7
A9
P
A11
A8
VSS
VDD
A12
NC,(A14)
R
NC,(A15) NC,A13)
Notes:
1) UDQS/UDQS is data strobe for upper byte, LDQS/LDQS is data strobe for lower
byte
2) UDM is the data mask signal for the upper byte UDQ0~UDQ7,
LDM is the data mask signal for the lower byte LDQ0~LDQ7
3) NC,(A13), NC, (A14) and NC, (A15) are additional address pins for future gener-
ation DRAMs and are not connected on this component.
4) Ball position G1 “RFU” will be used for BA2 on 1Gbit memory densities and
higher
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