參數(shù)資料
型號(hào): HYB3166165BT-40
廠商: SIEMENS A G
元件分類: DRAM
英文描述: 4M x 16-Bit Dynamic RAM
中文描述: 4M X 16 EDO DRAM, 40 ns, PDSO50
封裝: 0.400 INCH, PLASTIC, TSOP2-50
文件頁數(shù): 10/29頁
文件大?。?/td> 284K
代理商: HYB3166165BT-40
Semiconductor Group
10
HYB3164(5/6)165AT(L)-40/-50/-60
4M x 16 EDO-DRAM
AC Characteristics
5)6)
AC64-2E
T
A
= 0 to 70 °C,
V
CC
= 3.3 V
±
0.3V ,
t
T
= 2 ns
Parameter
Symbol
Limit Values
Unit
Note
- 40
- 50
- 60
min.
max.
min.
max.
min.
max.
Common Parameters
Random read or write cycle time
t
RC
t
RAS
t
CAS
t
RP
t
CP
t
ASR
t
RAH
t
ASC
t
CAH
t
RCD
t
RAD
t
RSH
t
CSH
t
CRP
t
T
69
84
104
ns
RAS pulse width
40
100k
50
100k
60
100k
ns
CAS pulse width
6
100k
8
100k
10
100k
ns
RAS precharge time
25
30
40
ns
CAS precharge time
Row address setup time
6
0
8
0
10
0
ns
ns
Row address hold time
5
7
10
ns
Column address setup time
0
0
0
ns
Column address hold time
5
7
10
ns
RAS to CAS delay time
9
30
11
37
14
45
ns
RAS to column address delay time
7
20
9
25
12
30
ns
RAS hold time
6
8
10
ns
CAS hold time
32
40
48
ns
CAS to RAS precharge time
5
5
5
ns
Transition time (rise and fall)
1
50
1
50
1
50
ns
7
Refresh period for 8k-refresh-version
t
REF
Refresh period for 4k-refresh version
t
REF
Refresh period for L-versions
128
128
128
ms
64
64
64
ms
t
REF
256
256
256
ms
Read Cycle
Access time from RAS
t
RAC
t
CAC
t
AA
t
OEA
t
RAL
t
RCS
t
RCH
40
50
60
ns
8, 9
Access time from CAS
10
13
15
ns
8, 9
Access time from column address
OE access time
20
10
25
13
30
15
ns
ns
8,10
Column address to RAS lead time
20
25
30
ns
Read command setup time
0
0
0
ns
Read command hold time
0
0
0
ns
11
相關(guān)PDF資料
PDF描述
HYB3165165T-50 4M x 16-Bit Dynamic RAM
HYB3164165BTL-60 INDUCTOR CHIP .10UH 5% 0805 SMD
HYB3165165BTL-60 4M x 16-Bit Dynamic RAM
HYB3166165BTL-60 4M x 16-Bit Dynamic RAM
HYB3164165TL-50 4M x 16-Bit Dynamic RAM
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