參數(shù)資料
型號(hào): M25PE40VMN6G
廠商: 意法半導(dǎo)體
元件分類: DRAM
英文描述: 4 Mbit Uniform Sector, Serial Flash Memory
中文描述: 4兆位統(tǒng)一部門,串行閃存
文件頁數(shù): 58/60頁
文件大小: 315K
代理商: M25PE40VMN6G
Revision history
M25PE40
58/60
14
Revision history
Table 27.
Document revision history
Date
Revision
Changes
01-Apr-2004
0.1
Document written
09-Nov-2004
1.0
Write Protect (W) pin replaced by Top Block Lock (TBL).
Section 2.5: Reset (Reset)
description modified. JEDEC signature
modified. Reset timings t
RLRH
, t
RHSL
and t
SHRH
removed from
Table 19: AC characteristics (33 MHz operation)
and inserted in
Table 21: Reset timings
(t
RHSL
modified). Document status
promoted from Target Specification to Preliminary Data.
01-Dec-2004
2.0
Top Block Lock (TBL) renamed as Top Sector Lock (TSL). Small text
changes. Deep Power-Down mode clarified in
Section 4.6: Active
Power, Standby Power and Deep Power-down modes
.
11-Jan-2005
3.0
Notes removed from
Table 26: Ordering information scheme
.
Wording changes. SO16 package removed, SO8 Wide package
added.
4-Oct-2005
4.0
Added
Table 19: AC characteristics (33 MHz operation)
. Document
status promoted from Preliminary Data to Datasheet.
Table 18: AC
characteristics (25 MHz operation)
updated.
Section 4.2: An easy
way to modify data
,
Section 4.3: A fast way to modify data
,
Section 6.9: Page Write (PW)
and
Section 6.10: Page Program (PP)
updated to explain optimal use of Page Write and Page Program
instructions. Clock slew rate changed from 0.03 to 0.1 V/ns.
Updated
Table 26: Ordering information scheme
. Added Ecopack
information.
11-Aug 2006
5
Changed document to new template; amended figure in Feature
summary; replaced
Figure 4: Bus master and memory devices on
the SPI bus
; amended data in
Table 18
and
Table 19
; amended title
of
Figure 30: VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad
Flat Package No lead 6 × 5 mm, package outline
and added a
footnote; amended name of the MP package in
Table 26: Ordering
information scheme
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