參數(shù)資料
型號: MAX1441GUP/V+
廠商: Maxim Integrated Products
文件頁數(shù): 12/41頁
文件大?。?/td> 0K
描述: IC PROXMITY SENSOR 2CH 20-TSSOP
其它有關(guān)文件: Automotive Product Guide
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 74
類型: 觸控式傳感器
輸入類型: 數(shù)字
輸出類型: 數(shù)字
接口: JTAG,串行
電流 - 電源: 100µA
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 20-TSSOP
包裝: 管件
MAX1441
Automotive, Two-Channel Proximity and
Touch Sensor
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(VDD = VAA, AGND = DGND, unless otherwise noted.)
VBATT to AGND.....................................................-0.3V to +45V
VAA, VDD to AGND..................................................-0.3V to +4V
SINPUT1, SINPUT2, AGUD1,
AGUD2 to AGND ...................................-0.3V to (VAA + 0.3V)
RESET, P0._, I.C. to DGND...................... -0.3V to (VDD + 0.3V)
AGND to DGND ...................................................-0.3V to +0.3V
OUT1, OUT2 to AGND ..........................................-0.3V to +28V
OUT_, P0._ Continuous Output Current.........................P 20mA
Continuous Power Dissipation (TA = +70NC)
Single-Layer PCB
20-Lead TSSOP (derate 11mW/NC above +70NC).......879mW
Multilayer PCB
20-Lead TSSOP (derate 13.6mW/NC above +70NC)..1084mW
Junction-to-Case Thermal Resistance (BJC) (Note 1)
20-Lead TSSOP ........................................................ +20NC/W
Junction-to-Ambient Thermal Resistance (BJA) (Note 1)
Single-Layer PCB
20-Lead TSSOP ........................................................ +91NC/W
Multilayer PCB
20-Lead TSSOP ..................................................... +73.8NC/W
Operating Temperature Range........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VBATT = 5V to 28V, VAA = VDD, TA = -40NC to +105NC. Typical values are at VBATT = 14V, fEX = 300kHz, TA = +25NC, unless oth-
erwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Average Power-Supply Current
16ms capacitance-to-digital (C2D) con-
version time, two active channels; CPU in
sleep mode
100
120
F
A
CAPACITANCE-TO-DIGITAL CONVERTER
Bit Resolution
12
Bits
Input Capacitance Range
CRNG_[1:0] = 10
20
pF
CRNG_[1:0] = 01
10
CRNG_[1:0] = 00
5
Input Capacitance LSB
Resolution
20pF capacitance range
4.8
fF
10pF capacitance range
2.4
5pF capacitance range
1.2
Integral Nonlinearity
INL
1
%FS
Differential Nonlinearity
DNL
0.5
LSB
Sampling Time
fEX = 300kHz (Note 3)
584
600
624
F
s
Number of Effective Bits
11
Bits
DC Input Current of SINPUT1,
SINPUT2
300
nA
INPUT CAPACITANCE EXCITATION SOURCE
Source Peak-to-Peak Voltage
300kHz excitation frequency
0.96
1.0
1.21
VP-P
Minimum Excitation Frequency
fEXMIN
Frequency Control register = 0x0A (Note 3)
100
kHz
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