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參數(shù)資料
| 型號： | MPC7457 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 57/68頁 |
| 文件大?。?/td> | 1755K |
| 代理商： | MPC7457 |
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MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
57
System Design Information
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-635-5102
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at
a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in
Table 3
, the intrinsic conduction thermal resistance paths are
as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 26
depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit
board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach material
(or thermal interface material), and finally to the heat sink where it is removed by forced-air convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon
may be neglected. Thus, the thermal interface material and the heat sink conduction/convective thermal resistances
are the dominant terms.
9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27
shows
the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal
interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the
External Resistance
(Note the internal versus external package resistance.)
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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相關(guān)代理商/技術(shù)參數(shù) |
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| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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