參數(shù)資料
型號(hào): MPC8308CZQAGD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA473
封裝: 19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, MAPBGA-473
文件頁數(shù): 77/88頁
文件大?。?/td> 2550K
代理商: MPC8308CZQAGD
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 1
Freescale Semiconductor
79
Thermal
22 Thermal
This section describes the thermal specifications of the device.
22.1
Thermal Characteristics
Table 59 provides the package thermal characteristics for the 473, 19
× 19 mm MAPBGA.
10
0010
1
2.5:1
8
00
0011
03:1
2
01
0011
03:1
4
10
0011
03:1
8
Note
s:
1 For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 333 MHz.
2 Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
Table 59. Package Thermal Characteristics for MAPBGA
Characteristic
Board Type
Symbol
Value
Unit
Notes
Junction to Ambient Natural Convection
Single layer board (1s)
RθJA
42
°C/W
1,2
Junction to Ambient Natural Convection
Four layer board (2s2p)
RθJA
27
°C/W
1,2,3
Junction to Ambient (@200 ft/min)
Single layer board (1s)
RθJMA
35
°C/W
1,3
Junction to Ambient (@200 ft/min)
Four layer board (2s2p)
RθJMA
24
°C/W
1,3
Junction to Board
RθJB
17
°C/W
4
Junction to Case
RθJC
9°C/W
5
Junction to Package Top
Natural Convection
Ψ
JT
2°C/W
6
Table 58. e300 Core PLL Configuration (continued)
RCWL[COREPLL]
core_clk: csb_clk Ratio1
VCO Divider (VCOD)2
0–1
2–5
6
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