參數(shù)資料
型號: MPC8308CZQAGD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA473
封裝: 19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, MAPBGA-473
文件頁數(shù): 82/88頁
文件大?。?/td> 2550K
代理商: MPC8308CZQAGD
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 1
Freescale Semiconductor
83
System Design Information
These decoupling capacitors should receive their power from separate VDD, NVDD, GVDD, LVDD, and
VSS power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed
directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, NVDD, GVDD, LVDD planes, to enable quick recharging of the smaller chip capacitors.
These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors are in the range of 100–330 F (AVX TPS tantalum or
Sanyo OSCON). However, customers should work directly with their power regulator vendor for best
values and types of bulk capacitors.
23.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to NVDD, GVDD, and LVDD as required. Unused active high
inputs should be connected to VSS. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, NVDD, AVDD1, AVDD2, GVDD, LVDD,
and VSS pins of the device.
23.5
Output Buffer DC Impedance
The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a
push–pull single-ended driver type (open drain for I2C, MDIO, and HRESET).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD
or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (Figure 55). The output
impedance is the average of two components: the resistances of the pull-up and pull-down devices. When
data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals
NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
相關(guān)PDF資料
PDF描述
MPC8308CZQADD 32-BIT, 266 MHz, MICROPROCESSOR, PBGA473
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相關(guān)代理商/技術(shù)參數(shù)
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MPC8308-KIT 功能描述:開發(fā)板和工具包 - 其他處理器 For MPC8308 Ethernet USB I2C SPI RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8308-NSG 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8308-NSG RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8308-NSG 制造商:Freescale Semiconductor 功能描述:MPC8308-NSG*NIC*
MPC8308-RDB 功能描述:開發(fā)板和工具包 - 其他處理器 Refer. Board MPC8308 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: