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參數(shù)資料
| 型號： | NT5TU64M16DG-3C |
| 廠商： | NANYA TECHNOLOGY CORP |
| 元件分類： | DRAM |
| 英文描述： | 64M X 16 DDR DRAM, 0.45 ns, PBGA84 |
| 封裝： | GREEN, BGA-84 |
| 文件頁數(shù)： | 50/85頁 |
| 文件大?。?/td> | 2622K |
| 代理商： | NT5TU64M16DG-3C |
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NT5TU256M4GE / NT5TU128M8GE / NT5TU64M16GG
1Gb DDR2 SDRAM
54
REV 1.0
06 / 2010
Clock Enable (CKE) Truth Table for Synchronous Transitions
Current State 2
CKE
Command (N) 3
, , ,
Action (N)
3
Notes
Previous
Cycle 1
(N-1)
Current
Cycle 1
(N)
Power-Down
L
X
Maintain Power-Down
11, 13, 15
L
H
DESELECT or NOP
Power-Down Exit
4, 8, 11, 13
Self Refresh
L
X
Maintain Self Refresh
11, 15, 16
L
H
DESELECT or NOP
Self Refresh Exit
4, 5, 9, 16
Bank(s) Active
H
L
DESELECT or NOP
Active Power-Down Entry
4,8,10,11,13
All Banks Idle
H
L
DESELECT or NOP
Precharge Power-Down Entry
4,8,10,11,13
H
L
AUTOREFRESH
Self Refresh Entry
6, 9, 11,13
Any State other
than listed above
H
Refer to the Command Truth Table
7
1. CKE (N) is the logic state of CKE at clock edge N; CKE (N-1) was the state of CKE at the previous clock edge.
2. Current state is the state of the DDR2 SDRAM immediately prior to clock edge N.
3. Command (N) is the command registered at clock edge N, and Action (N) is a result of Command (N).
4. All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document.
5. On Self Refresh Exit DESELECT or NOP commands must be issued on every clock edge occurring during the tXSNR period. Read commands may be issued only after tXSRD
(200 clocks) is satisfied.
6. Self Refresh mode can only be entered from the All Banks Idle state.
7. Must be a legal command as defined in the Command Truth Table.
8. Valid commands for Power-Down Entry and Exit are NOP and DESELECT only.
9. Valid commands for Self Refresh Exit are NOP and DESELCT only.
10. Power-Down and Self Refresh cannot be entered while Read or Write operations, (Extended) mode Register operations, Precharge or Refresh operations are in progress. See
section 2.8
"Power Down" and section 2.7.2 "Self Refresh Command" for a detailed list of restrictions.
11. Minimum CKE high time is 3 clocks, minimum CKE low time is 3 clocks.
12. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh.
13. The Power-Down Mode does not perform any refresh operations. The duration of Power-Down Mode is therefore limited by the refresh requirements.
14. CKE must be maintained high while the device is in OCD calibration mode.
15. "X" means "don't care (including floating around VREF)" in Self Refresh and Power Down. However DT must be driven high or low in Power Down if the ODT function is enabled
(Bit A2 or A6 set to "1" in MRS(1)).
16. Vref must be maintained during Self Refresh operation
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NT5TU64M16GG-AC | 制造商:Nanya Technology Corporation 功能描述:DRAM |
| NT5TU64M16GG-ACI | 制造商:Nanya Technology Corporation 功能描述:DRAM |
| NT5TU64M16HG-AC | 制造商:Nanya Technology Corporation 功能描述:MEMORY IC |
| NT5TU64M16HG-BE | 制造商:Nanya Technology Corporation 功能描述:MEMORY IC |
| NT6 | 功能描述:烙鐵 Weller Chisel Tip For WMP Solder Penc RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
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