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參數(shù)資料
| 型號： | RK80530KZ017512 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|PGA|370PIN|CERAMIC |
| 中文描述： | 微處理器| 32位|的CMOS |美巡賽| 370PIN |陶瓷 |
| 文件頁數(shù)： | 73/86頁 |
| 文件大小： | 882K |
| 代理商： | RK80530KZ017512 |
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Datasheet
73
Intel
Pentium
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
6.2
Thermal Specifications
This section describes the cooling requirements of the thermal cooling solution utilized by the
boxed processor.
6.2.1
Boxed Processor Cooling Requirements
The boxed processor is directly cooled with a fan heatsink. However, meeting the processor’s
temperature specification is also a function of the thermal design of the entire system and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in
Section 4.1
of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see
Table 29
in
Section 4.1
) in chassis that provide
good thermal management.
For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life.
Figure 32
illustrate an acceptable airspace clearance for the fan heatsink. It is
also recommended that the air temperature entering the fan be kept below 45 degrees C. Again,
meeting the processor’s temperature specification is the responsibility of the system integrator. The
processor temperature specification is found in
Section 4.1
of this document.
6.2.2
Boxed Processor Thermal Cooling Solution Clip
The boxed processor thermal solution requires installation by a system integrator to secure the
thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.
Motherboards designed for use by system integrators should take care to consider the implications
of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket
attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach
Figure 32. Thermal Airspace Requirement for all Boxed Intel Pentium III Processor with
512KB L2 Cache Fan Heatsinks in the PGA370 Socket
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RK80530KZ017512S L5XL | 制造商:Intel 功能描述:32BIT MPU 80530KZ017512 1.40G |
| RK80530KZ017512S L6BY | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor-S 64-Bit 0.13um 1.4GHz 370-Pin FCPGA2 |
| RK80530PZ001256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| RK80530PZ006256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| RK80530PZ009256 | 制造商:Rochester Electronics LLC 功能描述:PIII 1.2G 256 ON DIE CACHE FC-PGA2 - Bulk |
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