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參數(shù)資料
| 型號： | SAA6721E |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 圖形處理器 |
| 英文描述： | SXGA RGB to TFT graphics engine(XGA RGB 到 TFT圖形引擎) |
| 中文描述： | GRAPHICS PROCESSOR, PBGA292 |
| 封裝： | 27 X 27 MM, 1.75 MM HEIGHT, PLASTIC, SOT-489-1, BGA-292 |
| 文件頁數(shù)： | 68/72頁 |
| 文件大小： | 360K |
| 代理商： | SAA6721E |
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1999 May 11
68
Philips Semiconductors
Preliminary specification
SXGA RGB to TFT graphics engine
SAA6721E
14.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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| SAA6750 | Encoder for MPEG2 image recording EMPIRE |
| SAA6750H | Encoder for MPEG2 image recording EMPIRE |
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| SAA7102 | Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:12; Connector Shell Size:28; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAA6750 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Encoder for MPEG2 image recording EMPIRE |
| SAA6750H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Encoder for MPEG2 image recording EMPIRE |
| SAA6752HS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MPEG-2 video and MPEG-audio/AC-3 audio encoder with multiplexer |
| SAA6752HS/V103 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MPEG-2 video and MPEG-audio/AC-3 audio encoder with multiplexer |
| SAA6752HS/V103,557 | 功能描述:IC AUD/VID ENCODER MPEG 208-SQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 編碼器，解碼器，轉(zhuǎn)換器 系列:- 產(chǎn)品變化通告:Development Systems Discontinuation 26/Apr/2011 標(biāo)準包裝:1 系列:- 類型:編碼器 應(yīng)用:DVB-S.2 系統(tǒng) 電壓 - 電源，模擬:- 電壓 - 電源，數(shù)字:- 安裝類型:- 封裝/外殼:模塊 供應(yīng)商設(shè)備封裝:模塊 包裝:散裝 其它名稱:Q4645799 |
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