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參數(shù)資料
| 型號： | 24850 |
| 英文描述： | Parasite-Power Digital Thermometer |
| 中文描述： | Socket 754的設(shè)計(jì)和資格要求 |
| 文件頁數(shù)： | 24/40頁 |
| 文件大?。?/td> | 2405K |
| 代理商： | 24850 |
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Socket 754 Design and Qualification Requirements
24850 Rev. 3.07 August 2003
For a Socket 754 to be added to the AMD development partners list, they must meet all mechanical
requirements listed in Table 2 and Electrical requirements shown in Section 7 on page 29, when tested
in the sequence listed in
Figure 5 on page 23.
Table 2. Mechanical Qualification Test Procedures
Test Procedure
Test Condition
Requirements
Low Level Contact Resistance (LLCR)
EIA 364-23
100 mA maximum, 20 mV
336 contacts (168 contact pairs)
(minimum) monitored per test
sample
Record initially
After testing, LLCR-per-contact
must not exceed 20.0 m
with
alloy-194 pins.
Mechanical Shock
EIA 364-27 Condition A
50 G, 11 ms, half-sine
Conducted with 450 g heatsink test
mass attached to the retention
mechanism and PCB assembly
No physical damage
No contact interruptions greater
than 1.0 μs.
Random Vibration
EIA 364–28, Condition VII,
Level D
3.1 G rms, 20 to 500 Hz, 15
minutes per axis duration
Conducted with 450 g heatsink test
mass attached to the retention
mechanism and PCB Assembly
No physical damage
No contact interruptions greater
than 1.0 μs.
LLCR 20.0 m
maximum per
contact
Durability
EIA 364–09
Fifty cycles per test sample
No physical damage
LLCR 20.0 m
maximum per
contact
Thermal Shock
EIA 364–32
–55°C to +110°C, 30 minutes at
each extreme, five cycles
Group 2 samples exposed to the
environment mated
Group 3 samples exposed to the
environment unmated
No physical damage
Group 2—LLCR 20 m
maximum
per contact
Group 3—Insulation resistance
1000 M
minimum then DWV
650 Vac (See IR and DWV test
procedures on page 25)
24
Mechanical Test Procedure Conditions and Requirements
Chapter 6
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