參數(shù)資料
型號(hào): 24850
英文描述: Parasite-Power Digital Thermometer
中文描述: Socket 754的設(shè)計(jì)和資格要求
文件頁(yè)數(shù): 26/40頁(yè)
文件大小: 2405K
代理商: 24850
Socket 754 Design and Qualification Requirements
24850 Rev. 3.07 August 2003
Table 2. Mechanical Qualification Test Procedures (Continued)
Test Procedure
Test Condition
Requirements
Solvent Resistance
EIA 364-11
Four Solution Test in Table 1 of
EIA 364-11
No physical damage and markings
are legible
Socket Retention
Clamp Socket 754 so that a μPGA
package is accessible.
Place a μPGA package in the
clamped Socket 754, then close and
lock the socket.
With Socket 754 locked, pull the
μPGA package out of the socket
and record the force required.
Extraction force to be 8 kg
minimum
Record the forces required.
Porosity (Gold Contacts Only)
EIA 364-60
Test loose contacts (quantity - 20)
Procedure 1.1.1 (Au/Ni): Nitric
Acid Technique
Count and record pores.
Plating Thickness
EIA 364-48 Method C
20 contacts–measure the gold and
nickel thickness.
Thickness may be measured by X-
ray, florescence, or cross
sectioning.
30 microinch minimum–Gold
50 microinch minimum–Nickel
Resistance To Solder Heat
EIA 364-56
Using convection reflow, solder the
Socket 754 to the PCB.
Assembly is to be reflowed three
times.
No physical damage
Reflow soldering, solder stencil
parameters and solder paste
percentage tin and lead specified
Measured after three passes
through reflow
Flatness per Figure 3 on page 16,
Section A-A, before and after
soldering.
LLCR 20.0 m
maximum per
contact
26
Mechanical Test Procedure Conditions and Requirements
Chapter 6
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